Integrated CPU cooling and dust removal device

Abstract

The invention discloses an integrated CPU heat radiation and dust removal device. A heat radiator is fixed to a CPU, a fan is fixed to the heat radiator, and the fan, a conical barrel, a cylindrical barrel and a cyclone are integrally formed. The cyclone is provided with a plurality of tangential air inlets in a case, and electrostatic fibers with proper density and length are arranged in the conical barrel and the cylindrical barrel. A shaft is fixed to a case board, and the front end of the shaft is connected with the small end of a tower-shaped spring. A rotatable valve disc is connected with the large end of the tower-shaped spring, is flexibly matched with the shaft through a shaft sleeve and limits axial movement. The rotatable valve disc is provided with a stroke control sliding groove, the tower-shaped spring can expand and drive the rotatable valve disc to rotate when temperature is high, and vent holes of the case board coincide with vent holes of the rotatable valve disc. The tower-shaped spring with the quite high coefficient of thermal expansion, the electrostatic fibers with the proper density and length, the cyclone and other technologies are effectively integrated, dust removal and cold air automatic leading cooling and heat radiation are achieved, and the work reliability and stability of a computer are improved.

Description

technical field [0001] The invention relates to a heat dissipation and dust removal device, in particular to an integrated CPU heat dissipation and dust removal device. Background technique [0002] The computer is a very popular office equipment in today's society. It is generally composed of a chassis and a monitor. There are many electronic components combined in the chassis. Among them, the CPU consumes a lot of power and generates a lot of heat. Other components also have corresponding power consumption and heat. Therefore, good heat dissipation of the computer is particularly important. [0003] For CPU heat dissipation, fans and radiators with large air volume are usually configured to circulate air in the chassis. A small part of the heat in the chassis is diffused to the environment through natural convection on the outer wall of the chassis, and most of the heat is unified by the fan of the power box Draw out, and at the same time realize the ventilation and heat ...

AI Technical Summary

Problems solved by technology

[0004] In practical applications, if the environment is dusty and the temperature is high, the temperature of the entire computer will be high, which will easily cause failure and damage

Generally, the CPU fans of computers have more wind power, but due to the large amount of dust attached to the fan blades, the fan speed decreases, the load increases, and the cooling effect decreases; in addition, due to the large amount of dust attached to the radiator surface and circuit board, the heat dissipation The increase of thermal resistance leads to high temperature of electronic components, especially in summer, and the combination of multiple factors leads to poor cooling effect of the computer, which causes the temperature of the computer to be high and the work is prone to instability.

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