Interlock system used between wafer box mounting and dismounting device and semiconductor production machine stand
A technology for loading and unloading equipment and wafer cassettes, which is applied in the field of interlocking systems, can solve problems such as mechanical arm damage and wafer breakage, and achieve the effects of avoiding manual unloading, high cost performance, good scalability and maintainability
Inactive Publication Date: 2015-09-23
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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Problems solved by technology
Risk of wafer shattering and robotic arm damage if visual inspection is wrong
Method used
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[0015] The present invention will be further elaborated below by describing a preferred specific embodiment in detail in conjunction with the accompanying drawings.
[0016] Such as figure 1 As shown, an interlocking system for wafer cassette loading and unloading equipment and machine, including: PLC; wafer cassette detection module 1 at the machine end, wafer cassette in use module 2 at the machine end, and wafer cassette detection at the loading and unloading equipment end The output terminals of module 3 are respectively connected with the input terminals of PLC; the loading and unloading equipment is ready to load module 4, and the loading and unloading equipment is ready to unload module 5, and the input terminals thereof are respectively connected with PLC output terminals.
[0017] Among them, the model of the PLC in this embodiment is FX2N-16MR-D, the model of the loading and unloading equipment is LPT2200, and the model of the production machine is Archer10.
[0018...
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The invention discloses an interlock system used between a wafer box loading-unloading device and a semiconductor production machine stand. The interlock system comprises a PLC, a machine stand end wafer box detection module, a machine stand end wafer box in-use module, a loading-unloading device end wafer box detection module, a loading-unloading device pre-loading module and a loading-unloading device pre-unloading module, wherein output ends of the machine stand end wafer box detection module, the machine stand end wafer box in-use module and the mounting-dismounting device end wafer box detection module are respectively connected with an input end of the PLC, and input ends of the loading-unloading device pre-loading module and the loading-unloading device pre-unloading module are respectively connected with an output end of the PLC. By adopting the interlock system, communication between the loading-unloading device and the machine stand is realized, manual loading and unloading of wafer boxes are avoided, and the efficiency and the safety of wafer machining are increased.
Description
technical field [0001] The invention relates to a communication system between a wafer box loading and unloading equipment and a semiconductor production machine, in particular to an interlocking system between the wafer box loading and unloading equipment and a semiconductor production machine. Background technique [0002] At present, in order to make the opening of the wafer cassette safer, more convenient and clean, we use loading and unloading equipment to solve the loading / unloading of the wafer cassette. But the loading and unloading equipment is an external independent equipment. It has no communication with the production machine itself. So there is a risk of wafer shattering and robotic arm damage when unloading the cassette. [0003] There are two modes in the prior art to drive wafer cassette loading and unloading equipment: [0004] 1. The equipment automation system (EAP) sends a series of control commands to the loading and unloading equipment to complete i...
Claims
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IPC IPC(8): H01L21/677
Inventor 赵春雨韩玉龙凌意明王世辉
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP