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A quick and flexible bonding and sealing machine for poct real-time detection chip products

A technology for detecting chips and sealing machines, applied in material gluing, connecting components, mechanical equipment, etc., can solve the problems of affecting chip sealing, time-consuming, and chips are prone to bubbles, etc., to improve the degree of automation, optimize process parameters, Good sealing effect

Inactive Publication Date: 2016-10-26
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

First of all, the chip is prone to defects, the sealing is not complete, and the chip is prone to bubbles locally, which affects the sealing of the chip. As the sealing pressure increases, the microstructure array is easily deformed or even crushed.
Secondly, the degree of automation is low. Most of the current POCT real-time detection chip products that are glued and sealed are sealed manually, which takes a long time and has poor sealing effect.

Method used

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  • A quick and flexible bonding and sealing machine for poct real-time detection chip products
  • A quick and flexible bonding and sealing machine for poct real-time detection chip products
  • A quick and flexible bonding and sealing machine for poct real-time detection chip products

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Embodiment Construction

[0030] The specific real-time mode of the present invention will be described below in conjunction with the accompanying drawings:

[0031] The booster cylinder 1 is fixed on the upper plate 8, and the booster cylinder 1 is driven by a pneumatic system to make the flexible upper pressure head extend and retract;

[0032] A through hole is drilled in the center of the upper plate 8, and the diameter is 2mm larger than the piston rod of the booster cylinder 1; a through hole is machined on the left and right sides of the upper plate 8, and the through hole processing tolerance is H7, and each through hole is equipped with two flanged sliding sleeves 7 , the sliding sleeve 7 is symmetrically fixed in the through hole, and the sliding sleeve and the through hole have an interference fit;

[0033] The flexible upper pressing plate 5, the rigid upper pressing plate 9, and the guide rod connecting plate 4, which are fixed up and down together, constitute the flexible upper pressing h...

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PUM

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Abstract

A POCT chip product fast flexible bonding sealing machine comprises a pressure cylinder (1), a pneumatic system, guide rods, a floating connector, a guide rod connecting plate, a flexible upper pressing plate, a rigid lower pressing plate, sliding sleeves, an upper plate, a rigid upper pressing plate, stand columns, a flexible lower pressing plate, a sensor connecting plate, a sensor and detecting system and a lower plate. The pneumatic system drives the pressure cylinder, a flexible upper pressing head moves downwards in the work process, and is in contact with a chip to provide pressure, sealing is completed, flexile design is adopted in the upper pressing head and a lower pressing head, and the problem that due to the fact that the chip is not flat or the pressing heads are not flat, sealing is difficult can be effectively solved in the sealing process. Self-adaption adjusting design is adopted in the upper pressing head, the straightness and perpendicularity of the upper pressing head are guaranteed, the lower pressing head is fixed with a weighing sensor, the centering performance of the lower pressing head and the upper pressing head is good, and the structure is simple. The quality and speed of bonding sealing can be effectively improved through the design of the whole machine, and a foundation is laid for bonding sealing automation.

Description

technical field [0001] The invention relates to a POCT instant detection chip product, which is a flexible bonding and sealing device used for the POCT instant detection chip. Background technique [0002] POCT refers to any test performed outside of a testing center by a hospital professional or non-professional, referred to as a point-of-care test. Compared with the traditional central laboratory testing, point of care testing (POCT) has the characteristics of rapid acquisition of experimental results, simplified operation, less sample consumption, and the use of whole blood samples. However, one of the key problems to be solved in the production of POCT based on a lab-on-a-chip is the sealing of the chip. Sealing is the sealing of the substrate and the cover to complete the production of the chip, which is a key technology of microsystem packaging. Poor sealing quality can easily lead to chip leakage, can not be sealed, and also affect the appearance of the chip. Theref...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F16B11/00
CPCF16B11/006
Inventor 李经民张皓刘冲梁超刘军山王立鼎
Owner DALIAN UNIV OF TECH
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