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Apparatus and method for processing micropore through filamentous laser

A technology of laser filament formation and micro-holes, which is applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of easy collapse of micro-holes, limited diameter of micro-hole drilling, etc., to solve the problem that the taper is difficult to control. Effect

Inactive Publication Date: 2015-10-07
INNO LASER TECH CORP LTD
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Problems solved by technology

[0003] The object of the present invention is to provide a device and method for processing microholes by laser filament forming, which is used to solve the technical problems in the prior art that the diameter of the microholes is limited and the microholes are easy to collapse.

Method used

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  • Apparatus and method for processing micropore through filamentous laser

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Embodiment Construction

[0024] The present invention will be further elaborated below with reference to the accompanying drawings.

[0025] Ultrafast laser filamentation: Laser filamentation means that when ultrafast laser pulses are transmitted in the air medium, due to the combined action of the self-focusing effect and the defocusing phenomenon caused by the plasma generated after ionizing the air, a dynamic balance is achieved, so that Ultrafast laser pulses form long, relatively stable laser channels in air. The mechanism of laser filamentation on transparent materials, such as sapphire, glass, etc., is approximately the same as that in air. Therefore, it can be directly used in the micropore processing technology of transparent materials. Wherein, the above-mentioned ultrafast laser is picosecond or femtosecond laser.

[0026] see figure 1 , in this embodiment, the device of the present invention for processing microholes by laser wire forming is used for processing microholes with a diamete...

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Abstract

The invention provides an apparatus for processing a micropore through filamentous laser. The apparatus comprises a computer control module, a laser, a laser beam transmission assembly, a focusing assembly and a processing platform. The laser beam transmission assembly and the focusing assembly are arranged along the optical path of laser in order, the computer control module is used for controlling parameters of laser emitted from the laser to produce filamentous laser, and the computer control module also can control the focusing assembly and the processing platform to work, so that the laser beam can modify the structure of material to be process on the processing platform. The apparatus for processing the micropore through filamentous laser can be used for processing a high-quality micropore whose aperture is less than 20 [mu]m at high efficiency, the problems that a conventional laser processing conicity is hard to control and a micropore is hard to process can be solved.

Description

technical field [0001] The invention relates to the technical field of preparation of micropores on the surface of transparent materials, in particular to a device and method for laser filament processing micropores. Background technique [0002] When drilling transparent materials (sapphire, glass, etc.) with traditional lasers, there are the following problems: poor quality, chipping and melting; due to the characteristics of the laser itself, it will cause a certain taper; micro-holes are difficult to process because the slag is difficult to discharge; The pore size is limited, and it is difficult to process holes with micron diameters. Contents of the invention [0003] The object of the present invention is to provide a device and method for laser filament processing microholes, which are used to solve the technical problems in the prior art that the diameter of the microholes is limited and the microholes are easy to collapse. [0004] In order to achieve the above ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/382B23K26/0622B23K26/402B23K26/70
CPCB23K26/0093
Inventor 赵晓杰张杰秦国双
Owner INNO LASER TECH CORP LTD
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