Etching-assisted micro-ultrasonic machining device and etching-assisted micro-ultrasonic machining method

An ultra-sonic machining and fine-grained technology, applied in the field of ultrasonic machining devices, can solve problems such as undesired surface structure, uncertain etching direction, complicated process, etc., and achieve the effect of reducing the amount of side etching, slow etching speed, and simple operation

Active Publication Date: 2015-10-07
HUNAN CITY UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The reason for this structure is mainly due to the time difference between the upper and lower sides of the opening contacting the etching solution, plus the etching rate, resulting in a large amount of side etching.
[0003] A separate etching process is not efficient, the process is complicated, and the etching is anisotropic, that is, the direction of etching is uncertain, and the formed surface structure does not meet expectations

Method used

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  • Etching-assisted micro-ultrasonic machining device and etching-assisted micro-ultrasonic machining method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] An embodiment of the etching solution used to assist micro-ultrasonic machining of the present invention, the etching solution described in this embodiment is composed of the following components in mass percentage: ferric chloride 15%, acid 3%, benzotriazole 4 %, ethylenediamine 1%, sodium dodecylsulfonate 3%, and the balance is water; the acid is composed of perchloric acid, hypochlorous acid and sulfonic acid, and the perchloric acid, hypochlorous acid and The mass ratio of sulfonic acid is 1:7:8.

[0028] The etching solution described in this embodiment is prepared by the following method:

[0029] (1) Divide the water into four parts, add ferric chloride into the first part of water, fully dissolve, and then cool to room temperature to obtain the first premixed solution;

[0030] (2) adding the acid into the second part of water, and mixing evenly to obtain the second premixed liquid;

[0031] (3) adding benzotriazole, ethylenediamine and sodium dodecylsulfonate...

Embodiment 2

[0034] An embodiment of the etching solution used for assisting micro-ultrasonic machining of the present invention, the etching solution described in this embodiment is composed of the following components in mass percentage: ferric chloride 9%, acid 5%, benzotriazole 3 %, ethylenediamine 1%, sodium dodecylsulfonate 2%, and the balance is water; the acid is composed of perchloric acid, hypochlorous acid and sulfonic acid, and the perchloric acid, hypochlorous acid and The mass ratio of sulfonic acid is 2:12:25.

[0035] The preparation method of the etching solution described in this embodiment is the same as that in Example 1.

Embodiment 3

[0037] An embodiment of the etching solution used to assist micro-ultrasonic machining of the present invention, the etching solution described in this embodiment is composed of the following components in mass percentage: ferric chloride 10%, acid 4%, benzotriazole 3 %, ethylenediamine 1.5%, sodium dodecylsulfonate 3%, and the balance is water; the acid is composed of perchloric acid, hypochlorous acid and sulfonic acid, and the perchloric acid, hypochlorous acid and The mass ratio of sulfonic acid is 1:10:20.

[0038] The preparation method of the etching solution described in this embodiment is the same as that in Example 1.

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Abstract

The invention discloses an etching-assisted micro-ultrasonic machining device and an etching-assisted micro-ultrasonic machining method. The etching-assisted micro-ultrasonic machining device implements micro-ultrasonic machining by assistance of etching solution; after the etching solution is mixed and granulated, immersion workpieces or spraying workpieces are subjected to etching-assisted micro-ultrasonic machining; microcracks are formed on the surfaces of the workpieces by micro-ultrasonic vibration machining, and the etching solution can quickly and efficiently enter into the microcracks, so that crack clearances are enlarged, and micro-ultrasonic removal machining is facilitated; due to the improvement of machining efficiency, the time that the upper surface and the lower surface of an opening are in contact with the etching solution is shortened, and the lateral etching amount is correspondingly reduced; in addition, micro-ultrasonic and etching are combined together, ultrasonic can guide the flowing direction of the etching solution, and further the machining and forming precision is favorably guaranteed.

Description

technical field [0001] The invention relates to an ultrasonic processing device and method, in particular to an etching-assisted micro ultrasonic processing device and method. Background technique [0002] The principle of the chemical etching method is to use the chemical reaction between the metal and the etchant to form a soluble object to remove the reaction part, and to achieve the purpose of processing by controlling the part to be removed and the part to be protected. The structure processed by the etching method has the problem of large surface openings and small internal openings, and its cross-section is like a trapezoid. The reason for this structure is mainly due to the time difference between the upper and lower sides of the opening contacting the etching solution, plus the etching rate, resulting in a large amount of side etching. [0003] A separate etching process is not efficient, the process is complicated, and the etching is anisotropic, that is, the dire...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): C23F1/08C23F1/16
Inventor袁聪
OwnerHUNAN CITY UNIV