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Total-reflection laser bonding disassembling method

A technology of debonding and total reflection, applied in the field of debonding, which can solve the problem that the risk of device wafer separation and debris cannot be effectively solved, the wafer separation viscosity cannot be tolerated, and the mechanical strength of device wafers is low, so as to reduce the risk of debris. , easy to operate, adaptable to a wide range of effects

Active Publication Date: 2015-11-04
NAT CENT FOR ADVANCED PACKAGING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] However, due to the low mechanical strength of the thinned device wafer itself, it cannot withstand the viscosity during the wafer separation process, so that the risk of device wafer separation fragments has not been effectively solved. Bonding faces more problems

Method used

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  • Total-reflection laser bonding disassembling method

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Embodiment Construction

[0028] The present invention will be further described below in conjunction with specific drawings and embodiments.

[0029] like Figure 1 to Figure 5 Shown: In order to effectively reduce the risk of fragmentation of ultra-thin device wafers during the dismantling and separation process, the dismantling and bonding method of the present invention includes the following steps:

[0030] Step S1, providing a temporary bonding body to be disassembled and placing the temporary bonding body in the dismantling liquid 6; the temporary bonding body includes a device wafer 4 and a carrier located above the device wafer 4 Wafer 1, the carrier wafer 1 is bonded to the front surface of the device wafer 1 through a sacrificial layer 2 and a bonding adhesive layer 3;

[0031] like figure 1 As shown, during general implementation, the temporary bonding body also includes a debonding film 5, and the back side of the device wafer 4 is supported on the debonding film 5, and the device wafer ...

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Abstract

The invention relates to a total-reflection laser bonding disassembling method. The method comprises the steps of: S1, providing a temporary bonding body which is going to undergo bonding disassembling, and placing the temporary bonding body in a disassembling liquid; S2, using a laser to scan a slide wafer in the disassembling liquid, wherein the laser light, between the slide wafer and a sacrificial layer, of the laser is in a total-reflection state, so that the total-reflection laser light is utilized to remove the sacrificial layer; S3, removing the slide wafer so as to obtain a device wafer which is characterized in that the front surface is only provided with a bonding glue layer, and taking the device wafer out from the disassembling liquid; and S4, removing the bonding glue layer on the device wafer so as to obtain the device wafer after the bonding disassembling. According to the invention, the operation is convenient, the fragmenting risk of the ultrathin device wafer in the bonding disassembling process is effectively reduced, the application range is wide, and the method is safe and reliable.

Description

technical field [0001] The invention relates to a process method, in particular to a total reflection laser debonding method, which belongs to the technical field of debonding. Background technique [0002] With the development of people's requirements for electronic products in the direction of miniaturization, multi-function, and environmental protection, people strive to make electronic systems smaller, more integrated, and more powerful. Therefore, 2.5D packaging and 3D packaging with high packaging density have received extensive attention. [0003] In 2.5D packaging, the bonding of the carrier wafer and the device wafer is achieved using temporary bonding technology. Temporary bonding technology has the following advantages: first, the carrier wafer provides mechanical support and protection for the thin device wafer, so that the wafer backside process (thinning, etching, electroplating, etc.). For ultra-thin device wafers, device wafer-level processing can be achie...

Claims

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Application Information

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IPC IPC(8): H01L21/50H01L21/02H01L21/268
CPCH01L21/50H01L21/02H01L21/268
Inventor 李昭强姜峰
Owner NAT CENT FOR ADVANCED PACKAGING
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