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A tilting block lifting mechanism for wafer testing

A technology of wafer testing and lifting mechanism, which is applied in semiconductor/solid-state device testing/measurement, electrical components, semiconductor/solid-state device manufacturing, etc. It can solve the problems of poor lifting stability, high manufacturing cost, complex structure, etc., and reach the peak Large lift, low manufacturing cost, good structural strength

Active Publication Date: 2017-09-22
HANGZHOU CHANGCHUAN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention overcomes the deficiencies of the lifting mechanism used for wafer testing, such as small lifting force, poor lifting stability, low precision, complex structure, and high manufacturing cost, and provides a tilting block lifting mechanism for wafer testing. Large lifting force, good lifting stability, high precision, simple structure of lifting mechanism, low manufacturing cost, convenient installation, debugging and maintenance

Method used

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  • A tilting block lifting mechanism for wafer testing
  • A tilting block lifting mechanism for wafer testing
  • A tilting block lifting mechanism for wafer testing

Examples

Experimental program
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Effect test

Embodiment

[0023] Embodiment: a kind of inclined block lifting mechanism of wafer test (see attached figure 1 , attached figure 2 , attached image 3 ), including a base 1 and a supporting plate 2, the base and the supporting plate are in a rectangular structure, the base is fixedly connected with four lifting slide rail seats 3, and the lifting slide rail seat is vertical to the base. The four lifting slide rail seats are respectively arranged at four corner positions of the base. Supporting plate can be lifted and connected on the lifting slide rail seat, and the lifting slide rail seat is all provided with linear guide rail 15, and slide block 16 is slidably connected on the linear guide rail, and slide block is all fixedly connected with supporting plate lower surface. The four corner positions of the supporting plate are all fixedly connected with L-shaped connecting blocks 17, and the lifting slide rail seat and the connecting blocks are correspondingly provided with four, and t...

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Abstract

The invention discloses an oblique block elevating mechanism for a wafer test, and aims to solve defects that according to the conventional elevating mechanism for the wafer test, the lifting force is small, the lifting stability is poor, the precision is low, the structure is complex, and the manufacturing cost is high. The oblique block elevating mechanism comprises a base and a supporting plate, a plurality of elevating slide rail seats are fixedly connected on the base, the supporting plate is connected on the elevating slide rail seats in an elevating manner, the base is connected with a supporting seat in a sliding manner, the supporting seat is arranged below the supporting plate, the supporting seat is fixedly connected with a screw rod nut, the base is provided with a driving motor, an output shaft of the driving motor is connected with a screw rod in a transmission manner, the screw rod is connected with the screw rod nut in a cooperation manner, the supporting seat is provided with oblique blocks, the upper end surfaces of the oblique blocks are inclined planes, the supporting plate is provided with rollers, the rollers are abutted against the upper end surfaces of the oblique blocks, a grating scale used for displacement measurement of the supporting plate is arranged between the supporting plate and the base, the driving motor is electrically connected with an encoder, and the grating scale is electrically connected with the encoder.

Description

technical field [0001] The present invention relates to a kind of integrated circuit testing equipment, more specifically, it relates to a kind of inclined block lifting mechanism used for wafer testing. Background technique [0002] With the rapid development of the integrated circuit industry, the requirements for the yield rate of chip products are increasing day by day. Wafer testing can be carried out before the chip is processed in multiple subsequent processes such as cutting, wiring, and packaging, so as to reduce the serious waste of defective products in subsequent processing. Therefore, there is an urgent need for wafer testing equipment to meet the requirements of high speed, high efficiency, and high stability. [0003] The key for wafer test equipment to meet the requirements of high speed, high efficiency and high stability lies in the lifting mechanism. At present, the lifting mechanism used in wafer testing equipment has small lifting force, poor lifting st...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66H01L21/687
CPCH01L21/687H01L22/10
Inventor 方兆文胡东辉叶键波姚建强
Owner HANGZHOU CHANGCHUAN TECH CO LTD
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