Back electrode used for polyimide substrate copper indium gallium selenium thin film solar cell
A technology of solar cells and polyimide, applied in circuits, photovoltaic power generation, electrical components, etc., can solve the problems of high stress between the back electrode and polyimide substrate, and achieve the effect of preventing abnormal curling and reducing stress
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Embodiment 1
[0020] The invention provides a back electrode for a polyimide substrate 1 copper indium gallium selenium thin film solar cell, comprising a polyimide substrate 1, a stress buffer composite layer 3, a double-layer thick Mo thin film barrier layer, the The stress buffer composite layer 3 is formed on the polyimide substrate 1, and the double-thick Mo thin film barrier layer is formed on the stress buffer composite layer 3, and the stress buffer composite layer 3 is composed of Mo ultra-thin layer and Ag ultra-thin layer. The thin layer is repeatedly deposited and formed, the thickness of the Mo ultra-thin layer and the Ag ultra-thin layer are both 1nm, the repeated deposition times range is 20 times, and the double-layer thick Mo thin film barrier layer includes the first Mo thin film 4 and the second Mo thin film 4. Thin film 5 has a thickness of 100 nm and 600 nm, respectively.
[0021] Wherein, the barrier layer of the double-thick Mo thin film is a low-resistance residual c...
Embodiment 2
[0025] The invention provides a back electrode for a polyimide substrate 1 copper indium gallium selenium thin film solar cell, comprising a polyimide substrate 1, a stress buffer composite layer 3, a double-layer thick Mo thin film barrier layer, the The stress buffer composite layer 3 is formed on the polyimide substrate 1, and the double-thick Mo thin film barrier layer is formed on the stress buffer composite layer 3, and the stress buffer composite layer 3 is composed of Mo ultra-thin layer and Ag ultra-thin layer. The thin layer is repeatedly deposited and formed, the thickness of the Mo ultra-thin layer and the Ag ultra-thin layer are both 3nm, the repeated deposition times range is 35 times, and the double-layer thick Mo thin film barrier layer includes the first Mo thin film 4 and the second Mo thin film 4. Film 5 has a thickness of 150 nm and 650 nm, respectively.
[0026] Wherein, the barrier layer of the double-thick Mo thin film is a low-resistance residual compre...
Embodiment 3
[0030] The invention provides a back electrode for a polyimide substrate 1 copper indium gallium selenium thin film solar cell, comprising a polyimide substrate 1, a stress buffer composite layer 3, a double-layer thick Mo thin film barrier layer, the The stress buffer composite layer 3 is formed on the polyimide substrate 1, and the double-thick Mo thin film barrier layer is formed on the stress buffer composite layer 3, and the stress buffer composite layer 3 is composed of Mo ultra-thin layer and Ag ultra-thin layer. The thin layer is repeatedly deposited and formed, the thickness of the Mo ultra-thin layer and the Ag ultra-thin layer are both 5nm, the repeated deposition times range is 50 times, and the double-layer thick Mo thin film barrier layer includes the first Mo thin film 4 and the second Mo thin film 4. Film 5 has a thickness of 200 nm and 700 nm, respectively.
[0031] Wherein, the barrier layer of the double-thick Mo thin film is a low-resistance residual compre...
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Abstract
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