A back contact layer for flexible substrate copper indium gallium selenide thin film solar cells
A technology for solar cells and flexible substrates, applied in circuits, photovoltaic power generation, electrical components, etc., can solve problems such as large stress on the back contact layer and flexible substrates, and achieve the effect of preventing abnormal curling or film peeling and reducing stress.
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Embodiment 1
[0020] The invention provides a back contact layer for a flexible substrate 1 copper indium gallium selenium thin film solar cell, comprising a flexible substrate 1, a stress buffer composite layer 3, two Pd thin film barrier layers, the stress buffer composite layer 3 Formed on the flexible substrate 1, the two Pd film barrier layers are formed on the stress buffer composite layer 3, the stress buffer composite layer 3 is formed by repeated deposition of Pd ultra-thin layer and Cu ultra-thin layer, and the Pd ultra-thin film Both the thickness of the thin layer and the Cu ultra-thin layer are 1 nm, and the repeated deposition times range is 20 times. The two Pd film barrier layers include a first Pd film 4 and a second Pd film 5 .
[0021] Wherein, the two Pd film barrier layers are low-resistance residual compressive stress Pd films. A metal Cr transition layer 2 is also formed on the flexible substrate 1 , and the thickness of the metal Cr transition layer 2 is 100 nm.
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Embodiment 2
[0025] The invention provides a back contact layer for a flexible substrate 1 copper indium gallium selenium thin film solar cell, comprising a flexible substrate 1, a stress buffer composite layer 3, two Pd thin film barrier layers, the stress buffer composite layer 3 Formed on the flexible substrate 1, the two Pd film barrier layers are formed on the stress buffer composite layer 3, the stress buffer composite layer 3 is formed by repeated deposition of Pd ultra-thin layer and Cu ultra-thin layer, and the Pd ultra-thin film Both the thickness of the thin layer and the Cu ultra-thin layer are 3nm, and the repeated deposition times range is 35 times. The two Pd film barrier layers include the first Pd film 4 and the second Pd film 5, and the thicknesses are 150nm and 650nm respectively.
[0026] Wherein, the two Pd film barrier layers are low-resistance residual compressive stress Pd films. Al is also formed on the flexible substrate 1 2 o 3 transition layer 2, the Al 2 o ...
Embodiment 3
[0030] The invention provides a back contact layer for a flexible substrate 1 copper indium gallium selenium thin film solar cell, comprising a flexible substrate 1, a stress buffer composite layer 3, two Pd thin film barrier layers, the stress buffer composite layer 3 Formed on the flexible substrate 1, the two Pd film barrier layers are formed on the stress buffer composite layer 3, the stress buffer composite layer 3 is formed by repeated deposition of Pd ultra-thin layer and Cu ultra-thin layer, and the Pd ultra-thin film Both the thickness of the thin layer and the Cu ultra-thin layer are 5nm, and the range of repeated deposition times is 50 times. The two Pd thin film barrier layers include the first Pd thin film 4 and the second Pd thin film 5 .
[0031] Wherein, the two Pd film barrier layers are low-resistance residual compressive stress Pd films. Al is also formed on the flexible substrate 1 2 o 3 transition layer 2, the Al 2 o 3 The thickness of the transition l...
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Abstract
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