Back contact layer used for flexible substrate CIGS film solar battery
A technology for solar cells and flexible substrates, applied in circuits, photovoltaic power generation, electrical components, etc., can solve problems such as large stress on the back contact layer and flexible substrates, and achieve the effect of preventing abnormal curling or film peeling and reducing stress.
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Embodiment 1
[0020] The invention provides a back contact layer for a flexible substrate 1 copper indium gallium selenium thin film solar cell, comprising a flexible substrate 1, a stress buffer composite layer 3, a double-layer thick Pd thin film barrier layer, the stress buffer composite layer 3 is formed on the flexible substrate 1, the double-thick Pd thin film barrier layer is formed on the stress buffer composite layer 3, and the stress buffer composite layer 3 is formed by repeated deposition of Pd ultra-thin layer and Cu ultra-thin layer, the Both the Pd ultra-thin layer and the Cu ultra-thin layer have a thickness of 1 nm, the repeated deposition times range is 20 times, and the double-thick Pd thin film barrier layer includes a first Pd thin film 4 and a second Pd thin film 5 .
[0021] Wherein, the double-thick Pd film barrier layer is a low-resistance residual compressive stress Pd film. A metal Cr transition layer 2 is also formed on the flexible substrate 1 , and the thicknes...
Embodiment 2
[0025] The invention provides a back contact layer for a flexible substrate 1 copper indium gallium selenium thin film solar cell, comprising a flexible substrate 1, a stress buffer composite layer 3, a double-layer thick Pd thin film barrier layer, the stress buffer composite layer 3 is formed on the flexible substrate 1, the double-thick Pd thin film barrier layer is formed on the stress buffer composite layer 3, and the stress buffer composite layer 3 is formed by repeated deposition of Pd ultra-thin layer and Cu ultra-thin layer, the The thicknesses of the Pd ultra-thin layer and the Cu ultra-thin layer are both 3nm, and the repeated deposition times range is 35 times. The double-layer thick Pd thin film barrier layer includes the first Pd thin film 4 and the second Pd thin film 5, and the thicknesses are respectively 150nm and 650nm.
[0026] Wherein, the double-thick Pd film barrier layer is a low-resistance residual compressive stress Pd film. Al is also formed on the ...
Embodiment 3
[0030] The invention provides a back contact layer for a flexible substrate 1 copper indium gallium selenium thin film solar cell, comprising a flexible substrate 1, a stress buffer composite layer 3, a double-layer thick Pd thin film barrier layer, the stress buffer composite layer 3 is formed on the flexible substrate 1, the double-thick Pd thin film barrier layer is formed on the stress buffer composite layer 3, and the stress buffer composite layer 3 is formed by repeated deposition of Pd ultra-thin layer and Cu ultra-thin layer, the Both the Pd ultra-thin layer and the Cu ultra-thin layer have a thickness of 5 nm, and the repeated deposition times range is 50 times. The double-thick Pd thin film barrier layer includes a first Pd thin film 4 and a second Pd thin film 5 .
[0031] Wherein, the double-thick Pd film barrier layer is a low-resistance residual compressive stress Pd film. Al is also formed on the flexible substrate 1 2 o 3 transition layer 2, the Al 2 o 3 Th...
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