A fpc encapsulation process

Abstract

The invention relates to the technical field of flexible circuit board production, and in particular to an FPC encapsulating process. The FPC encapsulating process includes the following steps that A, a covering film is fed through a roller and conveyed to a drilling machine; B, the covering film enters the drilling machine so that a positioning hole can be punched, and the covering film is then conveyed to a die cutting machine after the positioning hole is punched; C, windowing work is conducted on the covering film by a plurality of die cutting heads by means of the die cutting machine, and all the die cutting heads can independently move in the X axis and the Y axis and can rotate; and E, the covering film enters an automatic film sticking machine so as to be stuck to a FPC board. By means of the FPC encapsulating process, the production cycle can be shortened, manual operation is replaced, and the production efficiency and the film sticking accuracy are improved.

Description

technical field [0001] The invention relates to the technical field of flexible circuit board production technology, in particular to an FPC encapsulation technology. Background technique [0002] At present, the earliest and most widely used technology in the domestic (FPC) flexible circuit board manufacturing industry is to apply the same adhesive as the copper foil board on the same film as the base film of the copper clad laminate. Make it a semi-cured adhesive film. [0003] The cover film needs to be window-opened, and the ambient temperature and humidity have a great influence on the follow-up process of the cover film. Therefore, it is necessary to shorten the time between the cover film being taken out of the cold storage and its use as soon as possible. [0004] After the release paper is removed, there are holes of various shapes on the cover film. The film without a skeleton is particularly difficult to operate. It is also difficult to use the positioning holes ...

AI Technical Summary

Problems solved by technology

[0004] After the release paper is removed, there are holes of various shapes on the cover film. The film without a skeleton is particularly difficult to operate. It is also difficult to use the positioning holes to overlap with the position on the line. Most factories use manual alignment. Position stacking, the operator will accurately position the window hole of the cover film and the connection plate and terminal of the circuit pattern, and then fix it after confirmation, which not only reduces the work efficiency, but also cannot guarantee the accuracy of the film sticking

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