A fpc encapsulation process

A process and station technology, applied in the field of flexible circuit board production technology, can solve the problems of low work efficiency, difficult operation, and inability to guarantee the filming accuracy, and achieve the effect of improving production efficiency and filming accuracy, and shortening the production cycle.

Active Publication Date: 2017-09-19
GUANGDONG HUAHENG INTELLIGENT TECH CO LTD
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] After the release paper is removed, there are holes of various shapes on the cover film. The film without a skeleton is particularly difficult to operate. It is also difficult to use the positioning holes to overlap with the position on the line. Most factories use manual alignment. Position stacking, the operator will accurately position the window hole of the cover film and the connection plate and terminal of the circuit pattern, and then fix it after confirmation, which not only reduces the work efficiency, but also cannot guarantee the accuracy of the film sticking

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A fpc encapsulation process
  • A fpc encapsulation process
  • A fpc encapsulation process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] Attached below figure 1 to attach Figure 4 , and specific embodiments will further illustrate the present invention.

[0039] Such as figure 1 As shown, a FPC encapsulation process includes the following steps: A: the covering film is fed through the roller 1 and sent to the drilling machine 2; B: the covering film enters the drilling machine 2 to make positioning holes, and after finishing After positioning the holes, it is sent to the die-cutting machine 3; C: The die-cutting machine 3 uses multiple die-cutting heads to open windows on the cover film, and each die-cutting head can independently perform X-axis, Y-axis movement and rotational movement; E : Enter the automatic film lamination machine 4 to laminate the FPC board.

[0040] This embodiment can shorten the production cycle, replace manual operations, and improve production efficiency and film-sticking precision.

[0041] In this embodiment, step D is also included between step C and step E. Step D: incl...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to the technical field of flexible circuit board production, and in particular to an FPC encapsulating process. The FPC encapsulating process includes the following steps that A, a covering film is fed through a roller and conveyed to a drilling machine; B, the covering film enters the drilling machine so that a positioning hole can be punched, and the covering film is then conveyed to a die cutting machine after the positioning hole is punched; C, windowing work is conducted on the covering film by a plurality of die cutting heads by means of the die cutting machine, and all the die cutting heads can independently move in the X axis and the Y axis and can rotate; and E, the covering film enters an automatic film sticking machine so as to be stuck to a FPC board. By means of the FPC encapsulating process, the production cycle can be shortened, manual operation is replaced, and the production efficiency and the film sticking accuracy are improved.

Description

technical field [0001] The invention relates to the technical field of flexible circuit board production technology, in particular to an FPC encapsulation technology. Background technique [0002] At present, the earliest and most widely used technology in the domestic (FPC) flexible circuit board manufacturing industry is to apply the same adhesive as the copper foil board on the same film as the base film of the copper clad laminate. Make it a semi-cured adhesive film. [0003] The cover film needs to be window-opened, and the ambient temperature and humidity have a great influence on the follow-up process of the cover film. Therefore, it is necessary to shorten the time between the cover film being taken out of the cold storage and its use as soon as possible. [0004] After the release paper is removed, there are holes of various shapes on the cover film. The film without a skeleton is particularly difficult to operate. It is also difficult to use the positioning holes ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): B65B41/12B65B61/02B65B33/02
CPCB65B33/02B65B41/12B65B61/02
Inventor 王伟倪沁心王曼媛丁惠英梁添贵
Owner GUANGDONG HUAHENG INTELLIGENT TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap