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Insulated Gate Bipolar Transistor Using Trench Gate Electrode

A bipolar transistor, insulated gate technology, applied in circuits, electrical components, semiconductor devices, etc., can solve the problems of IGBT on-state voltage reduction and hole density increase.

Active Publication Date: 2017-09-22
DENSO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with the case where the trench gate electrode extends on a straight line, when the trench gate electrode is bent, the hole density in the drift region located inside the bent portion will increase, thereby activating the conductivity modulation phenomenon, whereby the IGBT On-state voltage drop

Method used

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  • Insulated Gate Bipolar Transistor Using Trench Gate Electrode
  • Insulated Gate Bipolar Transistor Using Trench Gate Electrode
  • Insulated Gate Bipolar Transistor Using Trench Gate Electrode

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0033] figure 1 It is a plan view of the semiconductor substrate 2 of the IGBT 30 of the first embodiment, figure 2 (1) in figure 1 The sectional view of the II-II line. exist figure 1 In , the range X represents a top view with the emitter and the interlayer insulating film removed, and the range Y represents a top view with the emitter removed. exist image 3 and Figure 5 The same is true in . The IGBT 30 includes: a semiconductor substrate 2 ; an emitter 24 formed on the front surface 2 a of the semiconductor substrate 2 ; and a collector electrode 26 formed on the back surface 2 b of the semiconductor substrate 2 . The emitter electrode 24 and the collector electrode 26 are formed of metal.

[0034] The following regions are formed on the semiconductor substrate 2 .

[0035] Emitter region 10 : formed at a position facing a partial range of surface 2 a of semiconductor substrate 2 . It is doped with n-type impurities at a high concentration, and is in ohmic cont...

no. 2 example

[0055] Only the differences from the first embodiment will be described below, and repeated descriptions will be omitted. The same applies to the third and subsequent embodiments.

[0056] Such as image 3 As shown, in the second embodiment, the emission region 10 is divided into two regions 10b, 10c by the body contact region 8 . Also in this case, the occurrence of the latch-up phenomenon can be prevented by forming the inner semiconductor region 6 .

no. 3 example

[0058] Such as Figure 5 As shown, in the third embodiment, the emission region 10 is divided into four regions 10d, 10e, 10f, 10g by the body contact region 8 . In this embodiment, four emission regions are formed to face the trench gate electrode 18 and supply electrons to the channel, so that the on-state voltage is low. Although the latch-up phenomenon is more likely to occur, the occurrence of the latch-up phenomenon can also be prevented by forming the inner semiconductor region 6 in this case.

[0059] (Example of curved trench gate electrode)

[0060] Figure 6 to Figure 14 An example of a curved trench gate electrode is illustrated. The positions indicated by the circle marks indicate the range located inside the bent portion. Occurrence of the latch-up phenomenon can be prevented by forming the inner semiconductor region 6 at the corner portion indicated by the circle mark. Figure 13 , 14 The reference number 18a is a dummy trench. Here, the dummy trench refe...

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Abstract

An IGBT includes a trench gate electrode that is bent when a semiconductor substrate is seen in a plan view, and an inner semiconductor region of the same conductivity type as an emitter region is formed at a position inside a bent portion of the trench gate electrode and exposed on a front surface of the semiconductor substrate. The trench gate electrode is bent, and therefore, a hole density during operation increases, whereby conductivity modulation phenomenon is accelerated, and an on-state voltage is reduced. When the IGBT is turned off, the inner semiconductor region influences a movement path of the holes so that a moving distance thereof through a body region becomes short. The holes escape easily to a body contact region when the IGBT is turned off. Increase of current density during the operation and prevention of a latchup are both achieved.

Description

technical field [0001] This specification discloses a technique related to an IGBT (insulated gate bipolar transistor: insulated gate bipolar transistor) using a trench gate electrode. Background technique [0002] Patent Document 1 discloses an IGBT in which a trench gate electrode bends when viewed from above a semiconductor substrate. Compared with the case where the trench gate electrode extends on a straight line, when the trench gate electrode is bent, the hole density in the drift region located inside the bent portion will increase, thereby activating the conductivity modulation phenomenon, whereby the IGBT The on-state voltage decreases. In addition, Patent Document 1 was not disclosed when the present application was filed. [0003] In the case of using an IGBT, it is necessary not only to have a low on-state voltage, but also to cut off the emitter and collector when switching the voltage of the trench gate electrode to the off-state voltage. In this specificat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L29/739H01L29/78
CPCH01L29/0696H01L29/1095H01L29/7397H01L29/0804H01L29/0821
Inventor 大河原淳
Owner DENSO CORP