A Hybrid 3D Network-on-Chip

Abstract

The embodiment of the present invention discloses a hybrid three-dimensional network on chip, including: a plurality of horizontal sub-layers stacked in the vertical direction; wherein, the horizontal routing units in each horizontal sub-layer maintain the same topology; connecting the The vertical buses of the horizontal routing units located on the same vertical line in multiple horizontal sub-layers; wherein, the number of the vertical buses corresponds to the number of horizontal routing units in each horizontal sub-layer; control the vertical The vertical bus controller of the bus occupancy, by stacking multiple horizontal sub-layers in the vertical direction, forms a three-dimensional on-chip network, increases the interconnection in the vertical direction, shortens the global interconnection length inside the chip, and improves the internal bandwidth of the chip , reducing the delay and power consumption of data transmission.

Description

technical field [0001] The present invention relates to the technical field of on-chip network, and more specifically, relates to a hybrid three-dimensional on-chip network. Background technique [0002] Network-on-Chip (NoC) interconnection structure has become the development trend of chip architecture design, and it is one of the effective solutions for future on-chip IP core interconnection. The multi-core processor system-on-a-chip based on the NoC architecture can realize the separation of computing and communication. The computing subsystem composed of IP cores can independently complete computing tasks, and the communication subsystem composed of NoC is responsible for high-speed data exchange between IP cores. As the integrated circuit process enters the 14nm process era, the design scale of NoC continues to expand. Since all resource nodes are laid out on the plane, and the layout and wiring are carried out on the two-dimensional plane, the interconnection lines be...

AI Technical Summary

Problems solved by technology

The increase of the connection length directly brings about the increase of the system transmission delay, which limits the increase of the data transmission frequency. At the same time, due to the increase of the global connection length and the number of data forwarding times, the communication power consumption of the system will also increase.

Images