Chip encapsulating structure
A technology of chip packaging structure and circuit area, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve problems such as detachment, poor reliability of connector structure, etc., achieve high circuit density, improve bonding reliability, and good reliability flexible effect
Active Publication Date: 2015-11-25
CHIPMOS TECH INC
View PDF5 Cites 1 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
However, the flexible circuit board 220 configured in this way is only attached to the surface of the carrier board 210. Therefore, if this chip packaging structure 200 is applied to the plug of the connector, after many times of plugging and unplugging that can happen as figure 1 The phenomenon shown in the circled part, that is, the edge of the flexible circuit board 220 is lifted and separated from the carrier board
Therefore, the structural reliability of this kind of chip package structure 200 applied to the connector is not good.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0047] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed descriptions of the embodiments with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as: "upper", "lower", "front", "rear", "left", "right", etc., are only referring to the directions of the accompanying drawings. Accordingly, the directional terms used are illustrative, not limiting, of the invention. Also, in the following embodiments, the same or similar components will be given the same or similar symbols.
[0048] figure 2 is a schematic partial cross-sectional view of a chip packaging structure according to an embodiment of the present invention. image 3 It is a schematic top view of a flexible circuit board according to an embodiment of the present invention. Figure 4 It is a schematic diagram of a chip packaging structure applied to a plug of a connector...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention provides a chip encapsulating structure which includes a support plate, a flexible circuit board and at least one chip. The support plate includes an upper surface and a lower surface relative to the upper surface. The flexible circuit board has a first surface, a second surface relative to the first surface, and multiple pins. The pins are arranged on the first surface so as to partition the flexible circuit board to a circuit region and a circuit-free region. The flexible circuit board enables, through the bending of the circuit-free region, enables the second surface to be independently adhesive to the upper surface and the lower surface, wherein the upper surface corresponds to the circuit region and the lower surface corresponds to the lower surface. The flexible circuit board has a thickness of T1, and the circuit-free region has a minimum thickness of T2 at the bending position, wherein the minimum thickness T2 is smaller than the thickness T1. The chip is arranged on circuit region and is electrically connected to the pins.
Description
technical field [0001] The present invention relates to a semiconductor packaging structure, and in particular to a chip packaging structure. Background technique [0002] Due to the rapid development of wafer manufacturing technology, the integrated circuit (IC) industry has a rapid development trend, and the produced ICs are lighter, thinner and smaller, with complex functions, high pin count, high frequency and diversification. Under this development trend, chip-on-film (COF) packaging meets its packaging requirements. [0003] Chip-on-film packaging is a technology of flip-chip bonding (flip-chip bonding) on a flexible circuit substrate. That is to say, the driver integrated circuit and its electronic components can be directly mounted on the film, eliminating the traditional printed circuit board, so that the package structure can be lighter, thinner and shorter. Therefore, the thin-film chip-on-chip packaging can have fine pitch and good flexibility, so that it has...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/498
CPCH01L2224/16225
Inventor 陈崇龙
Owner CHIPMOS TECH INC