Device of three-dimensional integrated circuit and fabrication method of device

Abstract

The invention relates to the technical field of fabrication of a semiconductor, in particular to a device of a three-dimensional integrated circuit and a fabrication method of the device. By arranging a circuit component with an inductor capacitor on the surface of the back side of a wafer in a non-device region, the inductor capacitor contacts a large part of the area of the back side of the wafer, therefore, the area of the fabricated inductor capacitor is relatively large, and indexes such the capacity for storing electric energy, internal resistance and the like of the capacitor and the energy transmission index of the inductor can reach the requirement for device production; and meanwhile, the back side of the wafer can be used for forming a leading line, and thus, the large-area capacitor cannot affect the design and the distribution of other circuit components.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a three-dimensional integrated circuit device and a preparation method thereof. Background technique [0002] Inductors and capacitors are the most basic and important electronic components in electronic equipment, and are currently widely used in important fields such as computers, communications, transportation, and aviation. In electronic equipment with timing, filtering, and coupling devices, capacitors can store and intensify electrical energy, while inductance, as one of the properties of electronic circuits, has also received increasing attention in filtering, oscillating, and delaying circuits. [0003] With the advancement of science and technology and the improvement of social informatization, in the semiconductor integrated circuit design process, it is often accompanied by complex electronic components such as inductors and capacitors. For example,...

AI Technical Summary

Problems solved by technology

[0006] In view of the above problems, the present invention provides a three-dimensional integrated circuit device and its preparation method to solve the problem that the area of ​​the inductance and capacitance in the prior art is limited, resulting in the capacity of the capacitor to store electric energy, the internal resistance and the energy transmission index of the inductance not reaching the device. deficiencies in production requirements

Images