Unlock instant, AI-driven research and patent intelligence for your innovation.

A kind of processing method of polytetrafluoroethylene step groove circuit board

A technology of polytetrafluoroethylene and processing methods, which is applied in the fields of printed circuit, multilayer circuit manufacturing, printed circuit manufacturing, etc., can solve problems such as the difficulty in making PTFE stepped groove circuit boards, achieve improved electrical performance, simplify the manufacturing process, reduce The effect of the production process

Active Publication Date: 2018-02-23
SHENNAN CIRCUITS
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present invention provides a method for processing a polytetrafluoroethylene stepped groove circuit board to solve the technical problem that it is difficult to produce a PTFE stepped groove circuit board in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of processing method of polytetrafluoroethylene step groove circuit board
  • A kind of processing method of polytetrafluoroethylene step groove circuit board
  • A kind of processing method of polytetrafluoroethylene step groove circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Please refer to figure 1 , the embodiment of the present invention provides a kind of processing method of polytetrafluoroethylene (PTFE) stepped groove circuit board, may comprise:

[0018] 110. Provide a first laminate, the first surface of the first laminate has a stepped groove circuit; and, provide a second laminate, the first surface of the second laminate has a corresponding auxiliary circuits.

[0019] In the embodiment of the present invention, the PTFE stepped groove circuit board to be manufactured is decomposed into a first laminate and a second laminate with the bottom surface of the stepped groove as an interface, and is manufactured separately.

[0020] The first or second laminate can be a double-sided copper-clad laminate, or a multi-layer board based on double-sided copper-clad laminates. If it is a multi-layer board, before lamination, the multi-layer The inner metal layer of the board is processed into the inner circuit layer. In the embodiment of...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a processing method of a polytetrafluoroethylene stepped groove circuit board, which aims to solve the technical problem that it is difficult to manufacture a PTFE stepped groove circuit board in the prior art. The method includes: providing a first laminate, the first surface of the first laminate has a step groove circuit; providing a second laminate, the first surface of the second laminate has a circuit corresponding to the position of the step groove auxiliary circuit; form a high-temperature-resistant coating on the surface of the step groove circuit and the auxiliary circuit; carry out high-temperature pressing on the first laminate and the second laminate, so that the first laminate and the second laminate The polytetrafluoroethylene substrate is fusion-bonded, wherein the first side of the first laminate is opposite to the first side of the second laminate; on the second laminate corresponding to the auxiliary circuit position, process the stepped groove, and the depth of the stepped groove reaches the bonding surface of the stepped groove circuit and the auxiliary circuit.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for processing a polytetrafluoroethylene stepped groove circuit board. Background technique [0002] Polytetrafluoroethylene (PTFE, also known as Teflon) printed circuit board (Printed Circuit Board, PCB) refers to a circuit board made of laminated PTFE sheets. According to needs, some PTFE circuit boards need to make stepped grooves, and the bottom of the stepped grooves needs to form a stepped groove circuit. [0003] The general processing method of the step groove circuit board is as follows: firstly press to form a non-step groove level laminate, form a step groove circuit and other circuit patterns on the surface to be pressed of the laminate, and place a gasket on the step groove circuit, and then Laminates with step grooves are pressed together to form the required multilayer board, and then grooves are made on the surface of the multilayer board using a ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/46
Inventor 彭军董晋缪桦崔荣
Owner SHENNAN CIRCUITS