A solder ball pump head for laser soldering

A tin ball and laser technology, applied in tin feeding devices, welding equipment, metal processing equipment, etc., can solve the problems of large frictional resistance and difficult to achieve, and achieve the effect of low manufacturing cost, guaranteeing reliability, and improving the speed of ball ejection.
CN105108264BActive Publication Date: 2017-03-15WUHAN LINGYUN PHOTOELECTRONICS SYST
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Patents(China)
Current Assignee / Owner
WUHAN LINGYUN PHOTOELECTRONICS SYST
Publication Date
2017-03-15

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Abstract

The invention provides a solder ball pump head for laser soldering. The solder ball pump comprises an outer sleeve, a solder ball barrel installed on the outer sleeve, a rotor arranged in the outer sleeve and a motor driving the rotor to rotate. The outer wall of the cylindrical surface of the rotor is concaved inwards to form at least one ring of solder ball containing tank distributed circumferentially. The solder ball barrel is installed above the longitudinal plane where the solder ball containing tanks are located and communicated with the solder ball containing tanks. The lower portion of the outer sleeve is provided with ball falling channels communicated with a nozzle through a chute. When rotated to the lower portion, the solder ball containing tanks on the rotor are communicated with the ball falling channels; the solder ball containing tank at the upper end of the rotor is used for receiving a solder ball falling from the solder ball barrel, and the solder ball is closed in the solder ball containing tank when the rotor rotates, slides along the inner wall of the outer sleeve, and enters the corresponding ball falling channel of the outer sleeve till the solder ball containing tank moves to the lower portion of the rotor. According to the solder ball pump head, the manufacturing cost is low, machining precision can be easily guaranteed, and the fault that the ball gets stuck can be effectively reduced.
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Description

technical field

[0001] The invention relates to the field of laser automation, in particular to a solder ball pump head for laser soldering. Background technique

[0002] Common laser welding is a physical process from melting to recrystallization after the object to be welded is irradiated with laser light. The term is called "physical phase transition", and the recrystallization process also includes "alloy phase transition". Even "chemical changes" and so on, the final welded body, we call this welding form "laser fusion welding", the welding mechanism is as follows:

[0003] Physical phase transition: solid phase β†’ liquid phase β†’ solid phase

[0004] Alloy phase change: For the welding of two different substances, A and B, often when the phase change occurs, it will also be accompanied by the chemical phase change. For example, the alloy elements in A object will occur in the liquid phase. The combination of the metal bond with the carbon element in the second substanc...

Claims

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