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Underfill film, sealing sheet, production method for semiconductor device, and semiconductor device

A technology of underfill and manufacturing method, applied in the direction of semiconductor/solid-state device manufacturing, semiconductor device, semiconductor/solid-state device parts, etc. Effect

Inactive Publication Date: 2015-12-02
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, if a heat dissipation member is provided, not only the component cost of the heat dissipation member is required, but also the manufacturing process is increased, so there is also a problem that the cost increases.

Method used

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  • Underfill film, sealing sheet, production method for semiconductor device, and semiconductor device
  • Underfill film, sealing sheet, production method for semiconductor device, and semiconductor device
  • Underfill film, sealing sheet, production method for semiconductor device, and semiconductor device

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Effect test

Embodiment approach 1

[0113] A method of manufacturing the semiconductor device according to Embodiment 1 will be described. FIG. 2 is a diagram showing each step of the method of manufacturing the semiconductor device according to Embodiment 1. FIG.

[0114] In Embodiment 1, the sealing sheet 10 is used.

[0115] The manufacturing method of the semiconductor device according to Embodiment 1 includes: a bonding step of bonding the circuit surface 3 a of the semiconductor wafer 3 on which the connection member 4 is formed and the underfill film 2 of the sealing sheet 10; grinding the back surface 3 b of the semiconductor wafer 3 The grinding process of the semiconductor wafer 3, the wafer fixing process of attaching the dicing tape 11 to the back surface 3b of the semiconductor wafer 3, the peeling process of peeling the adhesive tape 1, and the exposed surface of the underfill film 2 of the semiconductor wafer 3 with the underfill film 2 A dicing position determination process of irradiating obliq...

Embodiment approach 2

[0162] A method of manufacturing a semiconductor device according to Embodiment 2 will be described. FIG. 5 is a diagram showing each step of a method of manufacturing a semiconductor device according to Embodiment 2. FIG.

[0163] In Embodiment 2, the sealing sheet 10 is used.

[0164] The method of manufacturing a semiconductor device according to Embodiment 2 includes a bonding step of bonding a semiconductor wafer 43 having circuit surfaces having connection members 44 formed on both sides thereof with the underfill film 2 of the sealing sheet 10, and dicing the semiconductor wafer 43 to form strips. Dicing process of the semiconductor chip 45 with the underfill film 2, pick-up process of peeling the semiconductor chip 45 with the underfill film 2 from the adhesive tape 1, irradiation on the exposed surface of the underfill film 2 of the semiconductor element 45 with the underfill film 2 Oblique light L, the position adjustment process of adjusting the relative position o...

Embodiment approach 3

[0179] A method of manufacturing a semiconductor device according to Embodiment 3 will be described. Embodiment 3 is the same as Embodiment 1 except that an underfill film is used instead of the sealing sheet 10 . As the base material, the same base material as the base material 1a can be used.

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Abstract

Provided are an underfill film and a sealing sheet which have excellent thermal conductivity and can successfully fill the space between a semiconductor element and a substrate. The present invention pertains to an underfill film which includes a resin and a thermally conductive filler, and in which the content of the thermally conductive filler is 50 vol% or higher, the average particle size of the thermally conductive filler relative to the thickness of the underfill film is a value of 30% or lower, and the maximum particle size of the thermally conductive filler relative to the thickness of the underfill film is a value of 80% or lower.

Description

technical field [0001] The present invention relates to an underfill film, a sealing sheet, a method for manufacturing a semiconductor device, and a semiconductor device. Background technique [0002] As a method of improving the heat dissipation of a semiconductor package or the like, there is a method of providing a heat dissipation member such as a heat sink. [0003] For example, Patent Document 1 discloses a technology for dissipating heat from the logic LSI by mounting a heat dissipation member on the logic LSI. Patent Document 2 discloses a technique of transmitting heat generated by a driver chip to a heat dissipation metal foil to dissipate heat. [0004] However, it is not desirable to install a heat dissipation member in a device such as a digital camera or a mobile phone where there is a limit on the size of the casing. In addition, if the heat dissipation member is provided, not only the component cost of the heat dissipation member is required, but also the m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/29H01L21/60H01L23/31C09J7/38
CPCH01L24/27H01L21/563H01L21/6836H01L23/295H01L24/13H01L24/16H01L24/29H01L24/32H01L24/81H01L2221/68327H01L2221/68336H01L2221/6834H01L2221/68377H01L2221/68381H01L2221/68386H01L2224/11002H01L2224/13111H01L2224/13144H01L2224/13147H01L2224/14181H01L2224/16238H01L2224/16268H01L2224/27003H01L2224/27436H01L2224/2929H01L2224/29298H01L2224/29386H01L2224/32225H01L2224/32245H01L2224/73104H01L2224/73204H01L2224/75753H01L2224/8113H01L2224/81193H01L2224/81203H01L2224/83191H01L2224/83862H01L2224/9211H01L2224/94C09J7/38H01L2224/11H01L2224/27H01L2924/0103H01L2924/01083H01L2924/01047H01L2924/01029H01L2924/01082H01L2924/05432H01L2924/207H01L2224/81H01L2224/83H01L2224/16225H01L2924/00C09J2301/302H01L23/3157
Inventor 盛田浩介高本尚英花园博行福井章洋
Owner NITTO DENKO CORP