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Ultrathin polyimide film and methods of making and assembling same

A polyimide film, polyimide technology, applied in the direction of coating, etc., can solve problems such as the difficulty of developing ultra-thin polyimide film

Active Publication Date: 2019-04-19
TAIMIDE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, limited by the process capability of known polyimide films, ultra-thin polyimide films are indeed difficult to develop
It is known that the thickness of the thinnest polyimide protective layer on the market can be less than 10 microns; however, it is almost impossible to prepare a polyimide film less than 5 microns with the existing biaxial stretching process Achieved goal
Moreover, the operability of glue distribution in downstream applications must also be considered

Method used

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  • Ultrathin polyimide film and methods of making and assembling same
  • Ultrathin polyimide film and methods of making and assembling same
  • Ultrathin polyimide film and methods of making and assembling same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Preparation of the first polyamic acid solution

[0045] Put 47.85 grams of ODA and 400 grams of DMAc as a solvent into a three-necked flask, stir at 30°C until completely dissolved, then add 49.05 grams of PMDA, and then add 5.62 grams of siloxane-containing polymer powder ( silicone powder). Wherein, the monomer accounts for 20wt% of the total weight of the reaction solution. Then, the first polyamic acid solution can be obtained by continuously stirring and reacting at 25° C. for 25 hours.

[0046] Preparation of the second polyamic acid solution

[0047] 47.85 grams of ODA and 400 grams of DMAc as a solvent are placed in a three-neck flask, stirred at 30°C until completely dissolved, and then added with 51.37 grams of PMDA, wherein the monomer accounts for 20wt% of the total weight of the reaction solution, and then continues at 25°C Stir and react for 25 hours to obtain the second polyamic acid solution.

[0048] Preparation of ultrathin polyimide film

[0049...

Embodiment 2

[0051] Repeat the steps of Example 1, but instead add 25 grams of silicone powder to the first polyamic acid solution. In this example, the monomer accounts for 20 wt% of the total weight of the reaction solution.

Embodiment 3

[0053] Repeat the steps of Example 1, but instead add 66.67 g of silicone powder to the first polyamic acid solution. In this example, the monomer accounts for 20 wt% of the total weight of the reaction solution.

[0054] Thin film performance test

[0055] Water contact angle test: The contact angle was measured using the sessile drop method (DSA10-MK2, Kruss). Use the light to irradiate the droplet, project it to the CCD to display the image on the monitor, and then control its built-in analysis software to calculate the contact angle, with an error of ±5°.

[0056] Peel strength test: Glue and press 18 micron copper foil on the surface of the ultra-thin polyimide layer, and use a universal material testing machine (Hounsfield H10ks) to measure according to IPC-TM650 2.4.9. And confirm that the peeled interface is between the base layer and the ultra-thin polyimide layer.

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Abstract

The invention discloses an ultrathin polyimide film and a preparing and combining method of the ultrathin polyimide film. The ultrathin polyimide film comprises a polyimide layer and a base layer, wherein the polyimide layer is provided with a first surface and a second surface which are opposite, and the base layer is attached to the first surface of the polyimide layer and comprises polyimide forming the main structure of the base layer. Siloxane-containing macromolecules are distributed on the polyimide layer or the base layer. The total weight of the base layer or the polyimide layer serves as the basis, the siloxane-containing macromolecules account for 5 weight percent to 40 weight percent, the stripping strength of the film is 0.004-0.1 kgf / cm, and the base layer can be stripped from the polyimide layer.

Description

technical field [0001] The invention relates to an ultra-thin polyimide film and its manufacturing and assembling method, in particular to the manufacturing and assembling method applicable to the ultra-thin polyimide film. Background technique [0002] In the printed circuit board, in order to protect the metal circuit, a polyimide protective layer (coverlay) is usually arranged on it. With the development of technology and product demand, the size of printed circuit boards tends to be light, thin and multi-functional. Reducing the overall thickness of printed circuit boards is also an important development goal in the industry. Among them, the thinning of polyimide protective layer has become a One of the important indicators of the overall design of the circuit board. [0003] However, limited by the process capability of known polyimide films, it is indeed difficult to develop ultra-thin polyimide films. It is known that the thickness of the thinnest polyimide protecti...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J7/04C08J5/18C08L79/08C08L83/04C08G73/10
Inventor 黄彦博
Owner TAIMIDE TECH