A kind of cob light source and its preparation process
A preparation process and technology for light sources, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of uneven light distribution of light source chips, long time required, inconvenient production, etc., and achieve good color temperature consistency and good consistency. , The effect of stable product quality
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Embodiment 1
[0023] Such as figure 2 As shown, a COB light source is characterized in that it includes: a heat dissipation substrate 1, a plurality of LED chips 2 are arranged on the heat dissipation substrate 1, and a circle of enclosure 3 is arranged on the outside of the plurality of LED chips 2, and the enclosure 3 is connected to the upper surface of the heat dissipation substrate 1; there is an electrode 7 in the enclosure 3; the LED chip 2 and the electrode 7 are connected by a gold wire 8; the outer surface of the LED chip 2 is covered with a hemisphere Shape cured silica gel 6; a layer of fluorescent powder 5 is uniformly deposited on the outside of the hemispherical cured silica gel 6; the upper surface of the phosphor powder 5 is silica gel 4.
[0024] The heat dissipation substrate 1 is an aluminum substrate.
[0025] The enclosure 3 is made of white silica gel.
[0026] A preparation process for a COB light source, characterized in that it comprises the following steps:
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Embodiment 2
[0033] Such as figure 2 As shown, a COB light source is characterized in that it includes: a heat dissipation substrate 1, a plurality of LED chips 2 are arranged on the heat dissipation substrate 1, and a circle of enclosure 3 is arranged on the outside of the plurality of LED chips 2, and the enclosure 3 is connected to the upper surface of the heat dissipation substrate 1; there is an electrode 7 in the enclosure 3; the LED chip 2 and the electrode 7 are connected by a gold wire 8; the outer surface of the LED chip 2 is covered with a hemisphere Shape cured silica gel 6; a layer of fluorescent powder 5 is uniformly deposited on the outside of the hemispherical cured silica gel 6; the upper surface of the phosphor powder 5 is silica gel 4.
[0034] The heat dissipation substrate 1 is a copper substrate.
[0035] The material of the enclosure 3 is PC material.
[0036] A preparation process for a COB light source, characterized in that it comprises the following steps:
...
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