Elastic pin POP structure and technique

Abstract

The invention relates to an elastic pin POP structure and a technique. The structure comprises an upper layer of package structure and a lower layer of package structure, wherein the upper layer of package structure comprises a substrate and a chip (2); the chip (2) is attached to the substrate (1); elastic pin modules (4) are arranged at the periphery of the chip (2); each elastic pin module (4) comprises two parts, namely an upper structure (4a) and a lower structure (4b); at least two breaches (4c) are formed in the top of each lower structure (4b) along the longitudinal direction; the upper surfaces of the elastic pin modules (4) are exposed on the surface of a plastic package material (6); and the upper layer of package structure is stacked on the lower layer of package structure. According to the elastic pin POP structure and the technique, a laser drilling or thinning technology is not needed; connection pins can be exposed after packaging; the technological processes are simplified; the production efficiency is improved; and the cost is reduced.

Description

technical field [0001] The invention relates to an elastic pin POP structure and a process method, belonging to the technical field of semiconductor packaging. Background technique [0002] With the development of microelectronics technology, the interconnection density of integrated circuits continues to increase. Two-dimensional interconnection has gradually become a bottleneck limiting the performance improvement of semiconductor chips, and microelectronic packaging is gradually inclined to 3D packaging. Chip stacking is one of the main ways to increase the density of electronic packaging. As the main way of packaging high-density integration, POP (package on package) has received more and more attention. Stacked packaging is an integrated circuit packaging technology that is used to combine discrete logic and storage ball grid array (BGA) packages in the vertical direction, and connect two or more packages, that is, stack. [0003] There are two traditional POP packagi...

AI Technical Summary

Problems solved by technology

[0004] 1. The traditional POP packaging structure requires laser drilling or thinning process to expose the upper and lower interconnected pins to the plastic packaging compound, and the process cost is high;

[0005] 2. The upper layer of the traditional POP structure cannot be directly installed with a plug-in packaging structure such as ordinary SOP

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