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A method for preventing burrs and warping of gold fingers on pcb

A gold-finger lead and gold-finger technology, which is applied to the formation of electrical connection of printed components, electrical connection of printed components, printed circuit components, etc., can solve the problems of burrs or warping of gold finger leads, so as to improve warping and ensure quality , Improve the effect of burrs

Active Publication Date: 2018-09-04
JIANGMEN SUNTAK CIRCUIT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the problem in the prior art that burrs or warps are likely to occur on the gold finger guide line when making beveled edges on the gold finger guide line of the PCB, and provides a method for preventing burrs and warping of the gold finger guide line on the PCB.

Method used

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  • A method for preventing burrs and warping of gold fingers on pcb
  • A method for preventing burrs and warping of gold fingers on pcb
  • A method for preventing burrs and warping of gold fingers on pcb

Examples

Experimental program
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Effect test

Embodiment

[0018] refer to image 3 , the present embodiment provides a method for preventing burrs and warping of the golden fingers on the PCB. 23 and gong empty area 24.

[0019] The PCB uses the positive film process to make the outer layer circuit. In the graphics drawn on the film, the width of the gold finger guide graphic is designed to be 0.25±0.025mm, and the end connecting the gold finger guide graphic and the gold finger graphic is designed as a horn shape. That is to say, both sides of the golden finger guide line figure are arc-shaped, and the radius of the circle where the arc is located is 0.3mm, and the central angle corresponding to the arc of the present embodiment is 90° (in other implementations, the corresponding arc can also be designed The central angle n of the film is 0<n≤90°); the hypotenuse area graphics and the gong empty area graphics are drawn on the film according to conventional techniques; through the exposure and development process, the graphics on th...

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Abstract

The invention relates to the technical field of circuit board production, in particular to a method for preventing burrs and warping of golden fingers on a PCB. In the present invention, the end connecting the gold finger line and the gold finger is designed in a trumpet shape, so that the joint between the gold finger line and the gold finger is wider, thereby improving the problem of the gold finger line warping and falling off when making the hypotenuse. Setting the line width of the gold finger line to 0.25±0.025mm can improve the problem of burrs on the gold finger line and ensure the quality of the product. The hypotenuse area is set as the oil-covered area and the oil-free area, which increases the area covered by the solder resist ink on the gold finger guide line, which can increase the adhesion of the gold finger guide line on the board surface, thereby further improving the problem of the gold finger guide line warping and falling off .

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for preventing burrs and warping of golden fingers on a PCB. Background technique [0002] With the rapid development of communication electronics and consumer electronics products, the growth of electronic connectors has been promoted. At the same time, the complexity of terminal products leads to the diversification of the structure of electronic connectors, such as: electronic connectors for sleeves, electronic connectors for interfaces, electronic connectors for internal assembly, golden fingers, etc. These connectors are from practicality Considering that, it is developing in the direction of miniaturization, complexity, light weight, multi-function, high reliability, and long life. The role of the gold finger is to provide low contact resistance for the contact between the separation device and other hardware, while the nickel-gold plating is to e...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/11H05K3/40
CPCH05K1/117H05K3/403H05K2201/09727H05K2203/304
Inventor 刘建辉白会斌谢国瑜梁健志
Owner JIANGMEN SUNTAK CIRCUIT TECH
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