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Methods for improving burrs on flexible substrates

A flexible substrate, burr technology, applied in nonlinear optics, instruments, optics, etc., can solve the problem of product yield decline, affecting ODF, high burr, etc.

Active Publication Date: 2022-01-18
TRULY SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, due to the limitations of the structure of the CF substrate during pre-cutting, a large number of high burrs will be formed on both sides of the slit after pre-cutting, which will affect the smooth progress of ODF and other processes and reduce the product yield.

Method used

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  • Methods for improving burrs on flexible substrates
  • Methods for improving burrs on flexible substrates

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Embodiment 1

[0038] The flexible substrate in this embodiment is a CF substrate. After the flexible substrate is pre-cut and before the burrs are not improved, its structure is as follows figure 1 As shown, the flexible substrate includes a substrate, a flexible substrate and an insulating layer. The substrate and the insulating layer are respectively attached to both sides of the flexible substrate. The insulating layer is made of epoxy resin material, and the thickness of the insulating layer is 10 μm. The pre-cutting is to cut the flexible substrate and the insulation layer, and the cutting place forms a cutout, and after cutting, the insulation layer produces burrs at the cutout place.

[0039] Using dry etching to improve the cutting burr of the flexible substrate includes the following steps:

[0040] providing the above-mentioned flexible substrate;

[0041] Coat the burr side of the flexible substrate with photoresist to form a photoresist surface. The photoresist surface is provi...

Embodiment 2

[0046] The flexible substrate in this embodiment is a CF substrate. After the flexible substrate is pre-cut and before the burrs are not improved, the flexible substrate includes a base material, a flexible underlayment and an insulating layer. The base material and the insulating layer are respectively attached to both sides of the flexible underlayment. , the insulating layer is made of acrylic resin material, and the thickness of the insulating layer is 12 μm. The pre-cutting is to cut the flexible substrate and the insulation layer, and the cutting place forms a cutout, and after cutting, the insulation layer produces burrs at the cutout place.

[0047] Using dry etching to improve the cutting burr of the flexible substrate includes the following steps:

[0048] providing the above-mentioned flexible substrate;

[0049]Coat the burr side of the flexible substrate with photoresist to form a photoresist surface. The photoresist surface is provided with an exposure area and ...

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Abstract

The invention relates to a method for improving the burr of a flexible substrate, which is used for reducing or eliminating the burr generated at the cutting edge after the flexible substrate is pre-cut, and adopts dry etching to reduce or eliminate the burr. After verification, it is found that after pre-cutting, one side of the flexible substrate will form a burr at the cutting edge, and the burr can be processed by a dry etching process to reduce the height of the burr, or even eliminate the burr, so that the flexible substrate can meet the requirements of subsequent The requirement of smooth board surface in the process greatly improves the yield rate of flexible substrates and the yield rate of subsequent processes, thereby improving production efficiency.

Description

technical field [0001] The invention relates to the technical field of preparation of flexible substrates, in particular to a method for improving burrs on flexible substrates. Background technique [0002] In the production process of flexible substrates such as color filter substrates, in order to facilitate the later binding can be carried out smoothly on TFT substrates (Thin Film Transistor, thin film transistor substrates), it is necessary to pre-coat CF substrates (ColorFilter, color filter substrates) ) is pre-cut to expose the bonding position (wire bonding position) on the TFT substrate. After pre-cutting, it goes through ODF process (One Drop Filling, liquid crystal dropping process), and then removes the excess part of the CF substrate after cutting the slivers. [0003] However, due to the limitations of the structure of the CF substrate during pre-cutting, a large number of high burrs will be formed on both sides of the slit after pre-cutting, which will affect...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/1335G02F1/1333
CPCG02F1/133305G02F1/133514G02F1/133516
Inventor 柳发霖董思娜方翠怡李林
Owner TRULY SEMICON
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