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Tin-alloy powder for preparing electronic grade silver-bearing high strength lead-free solder paste

A lead-free solder and tin alloy technology, applied in the field of tin alloy powder, can solve problems such as cracking of solder joints, insufficient impact resistance, poor electrical properties of products, etc., and achieve the effect of firm solder joints and good ductility

Inactive Publication Date: 2015-12-30
广东中实金属有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when used in vehicle-mounted environments and signal transmitting base station products, due to the alternating high and low temperature in the operating environment, the solder joints of existing products will crack and fall off, resulting in electrical failure of the product
Due to the particularity of the use environment, the impact resistance of the current product is insufficient. During the movement, due to the insufficient bonding strength, the solder joints will form cracks or cracks.

Method used

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  • Tin-alloy powder for preparing electronic grade silver-bearing high strength lead-free solder paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Take Ag2.0kg, Cu0.5kg, Bi1.5kg, Ce0.07kg, Nd0.007kg and the balance Sn95.923kg to make 45 micron tin alloy powder, take the above tin alloy powder 88kg and flux 12kg to make silver-containing high-strength Lead-free solder paste, test results are shown in Table 2.

Embodiment 2

[0018] Take Ag2.5kg, Cu0.7kg, Bi2.5kg, Ce0.08kg, Nd0.005kg and the balance Sn94.215kg to make 35 micron tin alloy powder, take the above tin alloy powder 88kg and flux 12kg to make silver-containing high-strength Lead-free solder paste, test results are shown in Table 2.

Embodiment 3

[0020] Take Ag3.0kg, Cu0.8kg, Bi3.5kg, Ce0.03kg, Nd0.003kg and the balance Sn92.667kg to make 25 micron tin alloy powder, take the above tin alloy powder 88kg and flux 12kg to make silver-containing high-strength Lead-free solder paste, test results are shown in Table 2.

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Abstract

The invention relates to tin-alloy powder for preparing electronic grade silver-bearing high strength lead-free solder paste, and the tin-alloy powder is characterized by being prepared from the following raw materials: 2.0 to 4.5 percent of Ag, 0.5 to 1.1 percent of Cu, 2.0 to 5.0 percent of Bi, 0.01 to 0.1 percent of Ce, 0.001 to 0.01 percent Nd and the balance of Sn, the tin-alloy powder is prepared into soldering paste, and the welding spot has the advantages and effects of resistance to high temperature, anti-fatigue performance, firm welding spot after welding, no cracking and shedding, good malleability, and anti-corrosion capacity.

Description

technical field [0001] The invention relates to a tin alloy powder for preparing electronic-grade lead-free solder paste, especially a kind of tin alloy powder for preparing electronic-grade silver-containing high-strength lead-free solder suitable for circuit board welding in high-low temperature cycle environments or environments with large changes in high and low temperature differences Paste tin alloy powder, which belongs to electronic soldering materials. technical background [0002] At present, Sn‐3.0Ag‐0.5Cu lead-free solder paste is mainly used in TV sets, video recorders, mobile phones, notebook computers, and computer products. In the use of this type of product, the solder joints will not crack and fall off during the service life of the product. However, when used in vehicle-mounted environments and signal transmitting base station products, due to the alternating high and low temperatures in the operating environment, the solder joints of existing products wi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26
CPCB23K35/262
Inventor 方喜波梁静珊熊有德方瀚宽方瀚楷
Owner 广东中实金属有限公司
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