A processing technology using double-sided adhesive tape as the medium
A processing technology and double-sided adhesive technology, which is applied in metal processing, adhesives, film/sheet adhesives, etc., can solve the problems of low adhesion between the protective film and the release film, cumbersome procedures, and complicated processes. Achieve the effect of solving punching displacement, reducing process difficulty and reducing the number of processes
Active Publication Date: 2017-04-12
SUZHOU DAXIANG NEW MATERIAL
View PDF6 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0003] such as die-cutting figure 1 During the adhesive product of described three-layer structure, the forming of protective film 1a, adhesive tape 2a, and release film 3a all need to go through processes such as compounding, positioning die-cutting in the die-cutting process, and the process is cumbersome and complex; the surface of the release film Coated with a release agent, the mutual adhesion between the protective film and the release film is small, and the material is prone to shift during the die-cutting process, resulting in inaccurate positioning and product shift
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0016] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.
[0017] The processing technology that takes the double-sided adhesive tape as the medium of the present embodiment, figure 2 shown, including the following steps:
[0018] (1) Die out two rows of parallel sleeve holes 5 on the surface of the release film A4, wherein the upper surface of the release film A4 is coated with a release agent, and then compound two parallel holes on the upper surface of the release film A4 Double-sided adhesive tape 6, these two double-sided adhesive tapes 6 are located between the two rows of positioning holes 5 and parallel to the straight line where the positioning holes 5 are located, that is, when the double-sided adhesive tape 6 is compounded, the positioning holes 5 cannot be covered;
[0019] In this step, the center of circle of each row of positioning holes 5 is located on the same straight line, and the...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a machining process with double-faced adhesive tape as a medium. The machining process comprises the following steps that (1) position setting holes are punched in the surface of a release film A, the double-faced adhesive tape is compounded on the upper surface of the release film A, and the double-faced adhesive tape is located at the inner sides of the position setting holes; (2) adhesive tape is compounded on the upper surface of the release film A, the adhesive tape is located at the inner side of the double-faced adhesive tape, a release film B is compounded on the upper surface of the adhesive tape, and the shape of the adhesive tape is punched through position setting; and (3) after waste of the adhesive tape and the release film B are removed through pulling, self-release films of the double-faced adhesive tape are removed, a protection film is compounded on the upper surface of the adhesive tape, the protection film is located at the inner sides of the position setting holes and compounded with the double-faced adhesive tape, the shape of the protection film is punched through position setting, waste of the protection film and the release film A are removed, a release film C is compounded with the surface of the adhesive tape, and an adhesive product is manufactured. By means of the machining process, the problem of punching displacement caused by low adhesive force between materials is effectively solved.
Description
technical field [0001] The invention belongs to the field of die cutting, and relates to a processing technology using double-sided adhesive tape as a medium. Background technique [0002] Die-cutting refers to the process of making raw materials into specific spare parts through precision machining and cutting according to a predetermined shape. In recent years, die-cut adhesive products have been widely used in optoelectronics, communications, computers, automobiles and other industries. Common structures of die-cut adhesive products include double-layer structure, three-layer structure, four-layer structure and multi-layer composite structure. During the operation process, positioning holes, positioning lines, etc. must be used for multiple compounding and punching to complete product processing. . [0003] such as die-cutting figure 1 During the adhesive product of described three-layer structure, the forming of protective film 1a, tape 2a, and release film 3a in the ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): B26F1/38B26D7/27C09J7/02
Inventor 胡荣胡宏宇陈进财
Owner SUZHOU DAXIANG NEW MATERIAL