Film patterning method

Abstract

The invention discloses a film patterning method, which comprises the following steps: firstly, forming a to-be-patterned film on the surface of a substrate; secondly, carrying the substrate to etching equipment to form a protective layer for blocking foreign matters on the surface of the to-be-patterned film before carrying out patterning on the to-be-patterned film; and finally, removing the protective layer, forming a patterned mask and etching the to-be-patterned film with the patterned mask to form the patterned film. Therefore, the to-be-patterned film with the protective layer can prevent the foreign matters from being adhered to the to-be-patterned film until an etching technology is carried out in the process of being carried to the etching equipment, and can effectively prevent the foreign matters from affecting the to-be-formed patterned film in the etching process, so as to reach the target of improving the product yield.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a method for patterning a film layer. Background technique [0002] At present, the important components inside the substrate include a variety of film layers with patterns. During the process of patterning the film layer, various foreign objects are easy to fall on the surface of the film layer to be patterned, and the film layer will be left in the etching process. Residue, causing poor display effect. [0003] Taking the active layer as an example, the existing active layer patterning method, the specific steps include: step 1, such as Figure 1a As shown, the gate pattern, the active layer film 02 and the photoresist layer film 03 are sequentially formed on the base substrate 01; Step 2, as Figure 1b As shown, the photoresist layer film 03 is exposed and developed, and the photoresist 031 is reserved in the area corresponding to the active layer 021 to be formed; Step 3, a...

AI Technical Summary

Problems solved by technology

Figure 1c and 1d It shows that after the active layer film 02 is etched, the active layer residue 022 is left. The main reason for this is that foreign matter falls on the active layer film before etching to form the active layer pattern, resulting in Etching cannot completely etch the graphic area that should be etched away, and usually the display screen will form defects such as bright spots or unevenness

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