Omnidirectional luminescence flexible LED filament and manufacturing method thereof

Abstract

The present invention discloses an omnidirectional luminescence flexible LED filament and a manufacturing method thereof. The flexible LED filament comprises a flexible substrate, an LED luminescence module and a fluorescence packaging layer. The flexible substrate is formed by laminating three layers of materials of a first copper foil layer, a polyimide base layer and a second copper foil layer, and a plurality of through holes having the equal intervals are arranged on the substrate. A line layer is formed on the first copper foil layer, and a positive electrode and a negative electrode are formed at the two sides of the substrate respectively and are connected with a driving power supply. The second copper foil layer is used for the heat radiation of the LED luminescence module, the LED luminescence module comprises a or a plurality of LED chip sets which are connected in parallel together, and each LED chip set is formed by connecting a plurality of LED chips in series. An LED chip is arranged in each through hole, and the LED chips are electrically connected with the line layer. According to the present invention, the 360-degreee omnidirectional luminescence is realized, and the flexible LED filament can be shaped into different shapes to combine into an LED bulb lamp having a high luminous efficiency.

Description

technical field [0001] The invention belongs to the technical field of LED lighting and relates to an LED filament, in particular to a flexible LED filament emitting light from all angles and a manufacturing method thereof. Background technique [0002] At present, the common method of obtaining white light from LEDs on the market is to use blue light or ultraviolet chips to excite yellow phosphor powder, and the yellow light emitted by the phosphor adhesive layer excited by blue light cooperates with the remaining blue light to form white light. However, the current packaging method generally adopted by enterprises is to fix the LED chips in series on the substrate in the form of front-mount or flip-chip, and after the electrical connection is completed, the electrodes are drawn out, and the current is passed through to drive the LED filament to emit light. [0003] Existing LED filament packages mostly use metal, ceramics, glass, sapphire and other materials as filament su...

AI Technical Summary

Problems solved by technology

However, transparent substrates such as ceramics, glass, and sapphire have problems such as the fragility of the material itself, poor adhesion between the material and the metal pattern on it, low thermal conductivity, and blue leakage on the side of the substrate due to double-sided glue dispensing on the transparent substrate. The high price of sapphire materials makes it difficult to reduce the production cost of LED filaments supported by transparent materials such as ceramics and sapphire.

Images