Semiconductor refrigeration cooling dustproof type power distribution cabinet
What is Al technical title?
Al technical title is built by PatSnap Al team. It summarizes the technical point description of the patent document.
A semiconductor and power distribution cabinet technology, applied in substation/power distribution device housing, electrical components, substation/switch layout details, etc., can solve the problems of shortened service life of electrical components, short circuit, low cooling and heat dissipation efficiency, etc., and achieve enhanced torque Effect
Inactive Publication Date: 2016-01-06
STATE GRID HENAN YANLING POWER SUPPLY +1
View PDF6 Cites 19 Cited by
Summary
Abstract
Description
Claims
Application Information
AI Technical Summary
This helps you quickly interpret patents by identifying the three key elements:
Problems solved by technology
Method used
Benefits of technology
Problems solved by technology
At present, the heat dissipation method and structure of the electrical components in the power distribution cabinet have the following defects: 1. Since the power distribution cabinets are generally high in height, vertical ventilation is adopted, the air path is long, and the cold air at the end of the air path has been blocked. Heating, so the temperature in the power distribution cabinet is still high, and the heat dissipation effect is poor, resulting in shortened service life of electrical components; 2. There is more dust at the air inlet of the air duct, so that the wind entering the power distribution cabinet carries more dust; 3. 1. After the electrical components are used for a long time, dust is easy to accumulate in the depressions and irregular protrusions of the electrical components, reducing the service life of the electrical components and forming a safety hazard (possibly causing a short circuit); 4. The air volume of the air circuit is not adjusted. Mechanism, high energy consumption, low cooling efficiency
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more
Image
Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
Click on the blue label to locate the original text in one second.
Reading with bidirectional positioning of images and text.
Smart Image
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0031] Such as Figure 1-Figure 8 As shown, the semiconductor refrigeration cooling and dustproof power distribution cabinet of the present invention includes a cabinet in the shape of a cuboid, and the cabinet is composed of a left side panel 1, a right side panel 2, a top panel 3, a bottom panel 4, a rear side panel 5 and a cabinet door (not shown in the figure) is composed of a horizontal partition 6 between the left side panel 1 and the right side panel 2, louvers 7 are respectively arranged on the left side panel 1 and the right side panel 2, the inner wall of the left side panel 1 and the right side panel The inner wall of the side plate 2 is provided with a cleaning structure at the shutter 7, and a left vertical plate 8 and a right vertical plate 9 are arranged between the top plate 3 and the bottom plate 4. The left vertical plate 8 is parallel and adjacent to the left side plate 1, and the right vertical plate 9 is parallel and adjacent to the right side plate 2, and t...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
PUM
Login to view more
Abstract
Provided is a semiconductor refrigeration cooling dustproof type power distribution cabinet. The semiconductor refrigeration cooling dustproof type power distribution cabinet comprises a cabinet body in a cuboid shape, the cabinet body is formed by a left side plate, a right side plate, a top board, a base plate, a rear side plate, and a cabinet door, a separating plate is arranged between the left side plate and the right side plate in a horizontal manner, the left side plate and the right side plate are respectively provided with shutters, a left vertical plate and a right vertical plate are arranged between the top board and the base plate, the left vertical plate is parallel and adjacent to the left side plate, the right vertical plate is parallel and adjacent to the right side plate, the left vertical plate and the right vertical plate are uniformly provided with air vents, electrical elements are respectively arranged at the right side of the left vertical plate and the left side of the right vertical plate, an air quantity rotation adjusting mechanism is arranged between the center of the top board and the center of the base plate, and the upper surface of the top board is provided with a refrigeration air supply device communicated with the air quantity rotation adjusting mechanism. According to the semiconductor refrigeration cooling dustproof type power distribution cabinet, the structure is simple, the operation is easy, the heat radiation effect is good, the energy consumption is low, the reliability is high, the dustproof effect is good, the electrical elements in the cabinet body can maintain the temperature for good work state via a structure for adjusting the air supply amount in multiple ways, and the service lifetime of the electrical elements is extended.
Description
technical field [0001] The invention relates to an electrical device, in particular to a semi-conductor cooling and dust-proof power distribution cabinet. Background technique [0002] The power distribution cabinet is the final equipment of the power distribution system, and it is the general name of the motor control center. The heat generated by the electrical components installed in the power distribution cabinet needs to be discharged continuously to ensure the normal operation of the electrical components. At present, the heat dissipation method and structure of the electrical components in the power distribution cabinet have the following defects: 1. Since the power distribution cabinets are generally high in height, vertical ventilation is adopted, the air path is long, and the cold air at the end of the air path has been blocked. Heating, so the temperature in the power distribution cabinet is still high, and the heat dissipation effect is poor, resulting in shorte...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
Application Information
Patent Timeline
Application Date:The date an application was filed.
Publication Date:The date a patent or application was officially published.
First Publication Date:The earliest publication date of a patent with the same application number.
Issue Date:Publication date of the patent grant document.
PCT Entry Date:The Entry date of PCT National Phase.
Estimated Expiry Date:The statutory expiry date of a patent right according to the Patent Law, and it is the longest term of protection that the patent right can achieve without the termination of the patent right due to other reasons(Term extension factor has been taken into account ).
Invalid Date:Actual expiry date is based on effective date or publication date of legal transaction data of invalid patent.