A device for reducing the diameter of low melting point welding wire and its application

A processing device and low melting point technology, applied in the field of electronic packaging and welding materials, can solve the problems of stuck mold, can not meet production requirements, easy to break, etc., achieve slow deformation, not easy to break wire, and solve the effect of broken wire

Active Publication Date: 2017-06-27
苏州步步盛新能源科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional die drawing process has extremely high requirements on the ductility of the alloy. For the SnBi alloy with poor ductility, it is easy to break and die during the traditional drawing process, which cannot meet the production requirements.

Method used

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  • A device for reducing the diameter of low melting point welding wire and its application

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A low-melting point welding wire diameter reduction processing device, comprising: a pre-drawing die 2, a roller 3, a constant temperature oil bath 4 and a motor 5; the low-melting point welding wire 1 passes through the pre-drawing die 2 and is cross-wound in two rows arranged in parallel. On the roller group consisting of twenty-four-pass rollers 3; the low melting point welding wire 1 is wound at the largest roller 3; the roller group is arranged in the constant temperature oil bath 4 and is driven by the motor 5 and The speed is the same.

[0022] The Sn-58Bi welding wire with a low melting point diameter of 2mm passes through a pre-drawing die with an inner diameter of 1.94mm, and then continuously crosses around two parallel rows of roller groups. The diameter of the rollers gradually increases. The entire roller group is immersed in a constant temperature oil bath. When the two parallel roller groups rotate at the same speed, the wire is collected at the largest ...

Embodiment 2

[0024] The Sn-42Bi welding wire with a low melting point diameter of 2mm passes through a pre-drawing die with an inner diameter of 1.92mm, and then continuously crosses around two parallel rows of roller groups. The diameter of the rollers gradually increases. The entire roller group is immersed in a constant temperature oil bath. When the two parallel roller groups rotate at the same speed, the wire is collected at the largest roller. The temperature of the constant temperature oil bath is 100°C. The diameter of the rollers in each pass is 4% larger than the diameter of the previous rollers. The rotation speed of the roller group is 7r / min. The final diameter of the welding wire was 1.65mm, and no wire breakage occurred during the wire drawing process.

Embodiment 3

[0026] The Sn-30Bi welding wire with a low melting point diameter of 2mm passes through a pre-drawing die with an inner diameter of 1.90mm, and then continuously crosses around two rows of parallel roller groups. The diameter of the rollers gradually increases. The entire roller group is immersed in a constant temperature oil bath. When the two parallel roller groups rotate at the same speed, the wire is collected at the largest roller. The temperature of the constant temperature oil bath is 110°C. The diameter of the rollers in each pass is 5% larger than that of the previous rollers. The rotation speed of the roller group is 5r / min. The final diameter of the welding wire was 1.48mm, and no wire breakage occurred during the wire drawing process.

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Abstract

The invention discloses a low melting point welding wire diameter reduction processing device, which includes: a pre-drawing die, a roller, a constant temperature oil bath and a motor box; the pre-drawing die is set at a position corresponding to the first roller; several passes The two rows of roller groups composed of the rollers are arranged in parallel, and the rollers of each pass are arranged staggered with each other, and the diameter is 3-6% larger than the diameter of the previous roller; the low melting point welding wire is collected at the largest roller; The roller group is set in the constant temperature oil bath and driven by the motor in the motor box with the same speed. This device is used to reduce the diameter of low-melting-point welding wire. When two parallel roller groups with gradually increasing diameters rotate at the same speed, the radial pulling force of the welding wire is obtained, and stable plastic deformation is produced at the specific temperature provided by the constant-temperature oil bath. Multi-pass deformation achieves the purpose of wire diameter reduction, especially suitable for low-melting point welding wire that is difficult to deform.

Description

technical field [0001] The invention belongs to the field of electronic packaging and welding materials, and particularly relates to a low-melting-point welding wire processing device that is difficult to deform and its application. Background technique [0002] The eutectic composition of SnBi solder is Sn58Bi, and the eutectic temperature is 138.5℃, which belongs to low temperature solder. The lower brazing temperature can not only reduce the thermal stress damage between different thermal expansion coefficients of welding materials, but also enable some electronic components with poor high temperature resistance to be used. Therefore, SnBi low-temperature solder has great application value in hierarchical packaging and brazing of temperature-sensitive materials. [0003] In electronic packaging, solder paste, electrodes and wires are the most common forms of soldering materials. At present, SnBi solder has appeared in the form of solder paste, welding rod and other prod...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B21C1/02B21C1/14
CPCB21C1/02B21C1/14
Inventor 周健姚瑶陈旭薛烽白晶
Owner 苏州步步盛新能源科技有限公司
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