Image sensing chip packaging structure and packaging method

An image sensor chip and packaging structure technology, applied in the semiconductor field, can solve problems such as virtual connection and breakage, and achieve the effects of improving integration, realizing miniaturization, and preventing virtual connection or even breaking.

Active Publication Date: 2016-01-13
CHINA WAFER LEVEL CSP
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  • Summary
  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

[0004] However, in this structure, the electrical connection layer 18 is arranged between the solder resist layer 20 and the insulating layer 16, and the insulating layer 16 is mostly formed of organic materials. There will be temper...

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  • Image sensing chip packaging structure and packaging method
  • Image sensing chip packaging structure and packaging method
  • Image sensing chip packaging structure and packaging method

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Embodiment Construction

[0046] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0047] In the following description, a lot of specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, and those skilled in the art can do it without departing from the meaning of the present invention. By analogy, the present invention is therefore not limited to the specific examples disclosed below.

[0048] Secondly, the present invention is described in detail in combination with schematic diagrams. When describing the embodiments of the present invention in detail, for the convenience of explanation, the cross-sectional view showing the device structure will not be partially enlarged according to the gener...

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Abstract

The invention provides an image sensing chip packaging structure. The packaging structure comprises an image sensing chip which has a first surface and a second surface, which are opposite, wherein the first surface is provided with an image sensing area and a welding pad arranged around the image sensing area; a through hole running from the second surface to the welding pad; an electrical wiring layer arranged along the inner wall of the through hole and extending to the second surface, wherein the electrical wiring layer is electrically connected with the welding pad; a solder resist layer filling the through hole and covering the electrical wiring layer, wherein an opening is formed in the solder resist layer, and the bottom portion of the opening exposing the electrical wiring layer; a guide welding pad covering the inner wall of the opening and the bottom portion of the opening and extending to the solder resist layer, wherein the guide welding pad is electrically connected with the electrical wiring layer; and welding bumps arranged on the guide welding pad, wherein the welding bumps are electrically connected with the guide welding pad. The structure reduces the defects of the image sensing chip electrical wiring layer.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to an image sensor chip packaging structure and packaging method. Background technique [0002] At present, wafer level packaging (WaferLevelPackaging) technology is the technology of testing and packaging the whole wafer and then cutting it to obtain a single finished chip. It gradually replaces the wire bonding packaging technology and becomes the mainstream technology of packaging. [0003] In the packaging of image sensors, wafer-level packaging technology is often used, such as figure 1 as shown in figure 1 As shown, it is an existing conventional image sensor packaging structure, which includes an image sensor chip 10 and a protective cover plate 20, an image sensor region 12 and a welding pad 14 are arranged on the first surface of the image sensor chip, and the protective cover The plate 20 is arranged above the image sensing region 12 to protect the image sensing r...

Claims

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Application Information

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IPC IPC(8): H01L27/146
Inventor 王之奇王卓伟谢国梁
Owner CHINA WAFER LEVEL CSP
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