6results about How to "Avoid thermal shock" patented technology

The invention provides a flax roving scouring and bleaching process which comprises the following steps: 1, loading flax roving into a creel with a Teflon coating in a loose uniform winding manner, and controlling the total yarn loading amount to be 75 + / -5% of the effective volume of a main scouring and bleaching pot; 2, soft water is injected into a saucepan according to the liquid ratio of 1: 10-1: 15, the temperature is increased to 65-75 DEG C, a nonionic penetrant is added, the creel in the step 1 is hung into the saucepan after operation is conducted for 5 minutes, heat preservation operation is conducted for 25-35 minutes in a positive and negative circulation alternating mode, and after waste liquid is discharged, normal-temperature soft water is used for washing twice in an overflow mode, and washing is conducted for 10 minutes each time; 3, formic acid and a metal ion chelating agent are added into a main pot, water is added till the liquid ratio is 1: 12, a circulating pump is started, the temperature is increased to 50-55 DEG C, the washed creel is put into the main pot, the temperature is kept, the stirring reaction is conducted for 20-30 minutes, the pH value is monitored and maintained to be 3.0-3.5 in the process, and after pickling is completed, waste liquid is pumped into a neutralization pool to be treated after being filtered through a stainless steel filter screen.

This invention discloses an automatic temperature-controlled chip aging test device, belonging to the technical field of chip aging test equipment. The aging test device includes a test chamber, inside which are respectively equipped with an air-cooling mechanism, a water-cooling mechanism, a humidification mechanism, a temperature-supplying mechanism, and placement components. A control module and a door lock mechanism are located on the outside of the test chamber. The control module is electrically connected to the air-cooling mechanism, the water-cooling mechanism, the humidification mechanism, and the temperature-supplying mechanism. This invention combines pressure compensation and air-cooling cooling by introducing gradually decreasing temperature gas into the test chamber during the depressurization process of the air-cooling mechanism. This avoids the thermal shock caused by introducing room temperature air and shortens the cooling waiting time. The water-cooling mechanism starts after the chamber temperature drops to a preset value, introducing gradually decreasing temperature cooling water into the water-cooling head. The water-cooling head directly contacts the cooling chip for efficient localized heat dissipation. Combined with the overall cooling of the air-cooling mechanism, this achieves synergistic complementarity between air-cooling and water-cooling.

This invention relates to the field of integrated circuit technology and discloses a three-temperature equipment gas heating system, comprising four modular heating groups connected in parallel to the main air intake pipeline. Each group includes a first-stage electro-gas heating unit, a series connecting pipeline, and a second-stage electro-gas heating unit. The two stages of heating units are connected by a Teflon flexible pipeline. The main controller controls the first-stage electro-gas heating unit to undertake 70% of the total system heat load for large-temperature-rise coarse preheating, and controls the second-stage electro-gas heating unit to undertake 30% of the total heat load for small-temperature-rise fine-tuning heating. This invention overcomes the thermal inertia lag and temperature overshoot caused by single-stage heating through stepped temperature rise distribution and segmented composite dynamic control, controlling the steady-state temperature fluctuation of the output airflow within ±1 degree Celsius, and utilizing a redundant architecture to ensure the continuous gas supply capability of the equipment under single-point failure.

The application discloses a system and method for dynamic heat standby of a steam turbine bypass system, comprising a main steam main pipe, a condenser, a steam turbine high-pressure cylinder and a plurality of bypass branches, wherein the bypass branches comprise a bypass pipe, a drain trap, a bypass valve group, a steam turbine inlet pipe and a circulating pipeline; the main steam main pipe is connected with the inlet of the drain trap and the inlet of the bypass valve group through the bypass pipe, the main steam main pipe is connected with the inlet of the steam turbine high-pressure cylinder through the steam turbine inlet pipe, the first outlet of the bypass valve group is connected with the condenser, and the second outlet of the bypass valve group is connected with the steam turbine inlet pipe through the circulating pipeline, so that the system and method can avoid heat shock of the bypass pipe and the bypass valve group caused by the input of the bypass system.

This invention provides a variable-temperature forging process for difficult-to-deform lightweight aluminum / magnesium alloys. The process involves determining the recrystallization temperature to lock in the preheating temperature; heating the difficult-to-deform aluminum or magnesium alloy billet to the preheating temperature; maintaining a die temperature 50-200°C higher than the billet temperature; implementing an initial temperature transfer deformation process on a forging press, with the die at a high temperature and the billet at a low temperature; ensuring the die temperature is 50-200°C higher than the billet temperature; performing plastic deformation at the same temperature for both the die and the billet when the forging deformation reaches 1 / 3-2 / 3 of the stage; maintaining pressure with the die temperature 50-100°C lower than the billet temperature; water quenching the formed forging, followed by aging heat treatment. This variable-temperature forging process for difficult-to-deform lightweight aluminum / magnesium alloys reduces the tendency for deformation damage during deformation, ensures low-temperature deformation of the workpiece without damage or cracking, improves the deformation uniformity of the workpiece, and optimizes its microstructure and mechanical properties.

This application relates to a testing apparatus and temperature control method for vehicle-mounted storage devices, including a housing and a testing platform disposed within the housing. Each testing platform is equipped with at least one temperature control component. Each temperature control component includes a temperature control board, a first temperature sensor, a second temperature sensor, a heating element, and a test socket for the device under test (DUT). The temperature control board is electrically connected to the first temperature sensor, the second temperature sensor, and the heating element. The first temperature sensor and the heating element are respectively disposed inside the DUT test socket. The first temperature sensor is used to detect the temperature inside the DUT test socket. The second temperature sensor is disposed on the temperature control board and is used to detect the temperature of the temperature control board. The temperature control board automatically shuts off heating and temperature control, and cools the device by utilizing the internal temperature of the housing. This application has low testing costs, and the testing platform is not easily damaged; readily available testing platforms can be used, reducing development costs and design complexity.