Heat dissipation structure of high-power electronic devices

Abstract

In order to solve the problems of limited heat dissipation efficiency, unsatisfactory requirements, complex structure, and limited use of existing heat dissipation methods for high-power electronic devices, the present invention proposes a heat dissipation structure for high-power electronic devices. The heat dissipation structure of the high-power electronic device of the present invention includes an inner heat dissipation box and insulating grease; the inner heat dissipation box is a closed structure filled with insulating grease, and the printed circuit board installed with the high-power electronic device is immersed in the insulating grease as a whole and Spacers are fixed to the bottom of the inner radiator. The beneficial technical effect of the heat dissipation structure of the high-power electronic device of the present invention is that the working temperature of the high-power electronic device can be effectively reduced, so that its working performance can be fully exerted. Moreover, the structure is simple and convenient to use.

Description

technical field [0001] The invention relates to a high-power electronic device heat dissipation technology, in particular to a high-power electronic device heat dissipation structure. Background technique [0002] High-power electronic devices usually refer to electronic devices such as field effect tubes, integrated circuits, transformers, inductors, and semiconductor refrigerators. Since high-power electronic devices work under relatively large current or voltage conditions, the devices themselves will generate large of heat. However, the operating temperature of high-power electronic devices is usually limited, beyond which the operating performance or efficiency will be greatly reduced, and some may even be burned. In addition, high-power electronic devices are usually mounted on printed circuit boards together with other electronic components, not only generating heat themselves, but other electronic components may also generate heat, causing mutual influence. The hea...

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Problems solved by technology

[0003] In order to solve the problems of limited heat dissipation efficiency in the heat dissipation methods of high-power electronic devices in the prior art, which cannot meet the requirements, or have complex structures and limited use, the present invention proposes a heat dissipation structure for high-power electronic devices

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