Large power LED light source

Abstract

The invention provides a large power LED light source. The large power LED light source comprises a substrate and a plurality of LED wafers, wherein the surface of the substrate is covered with an insulating layer and a metal layer from the bottom to the top; a circuit, an anode and a cathode are arranged on the metal layer; the substrate also includes a solid phase crystallization area of LED wafers; the circuit is arranged in the solid phase crystallization area; the plurality of LED wafers are fixed on the substrate, and are electrically connected with the circuit; the circuit is electrically connected with the anode and the cathode; the bottom of each LED wafer is provided with an alloy layer; the alloy layer is fused in the substrate; and the alloy layer is a gold-tin alloy layer. Compared with the prior art, a eutectic layer is generated when the aluminium nitride ceramic substrate is welded with the gold-tin alloy layer through eutectic soldering. The eutectic layer is high in the heat conduction coefficient and high in heat stability, and can satisfy the heat radiation requirement for the large power LED chip during the solid phase crystallization process.

Description

technical field [0001] The invention relates to the technical field of lighting, in particular to a high-power LED light source. Background technique [0002] Like traditional light sources, semiconductor light-emitting diodes (LEDs) also generate heat during operation, the amount of which depends on the overall luminous efficiency. Its electro-optical conversion efficiency is only about 20-30%, that is to say, about 70% of the electric energy is turned into heat energy. [0003] However, the characteristic of the LED chip is that it generates extremely high heat in a very small volume, and the heat capacity of the LED itself is very small, so the heat must be conducted out at the fastest speed, otherwise a high junction temperature will be generated. , In order to draw the heat out of the chip as much as possible, people have made many improvements in the chip structure of the LED. [0004] In order to improve the heat dissipation of the LED chip itself, the main improvem...

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Problems solved by technology

[0005] The purpose of the present invention is to solve the defect of low thermal conductivity of the eutectic layer in the prior art, and provide a high-power LED light source to solve the above problems

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