Semiconductor processing equipment and online fault detection method thereof

Abstract

The present invention discloses a semiconductor processing device including a semiconductor processing module, a fluid transmitting module, a fluid supporting module and a controlling module. The semiconductor processing module includes a micro cavity for accommodating and processing semiconductor wafers. The fluid supporting module also includes a plurality of containers for supporting various fluids, and a plurality of weight sensors arranged under the containers respectively. Each weight sensor senses the weight of the container thereon, and transmits the sensed weight data of the corresponding container to the controlling module. The fluid transmitting module transmits the unused fluid in the containers to the micro cavity through a pipe and the inlet of the micro cavity, and collects the used fluid discharged from the micro cavity into the containers through the outlet of the micro cavity and a pipe. The weight of each container is monitored in real time due to the weight sensors arranged under the containers, the monitoring data is used to judge whether a plurality of components in the current semiconductor processing device are in the normal operation state or not, and the analysis should be timely performed if problems are found out and the place where the fault possibly occur is deduced.

Description

[0001] 【Technical field】 [0002] The invention relates to the field of semiconductor surface treatment, in particular to a semiconductor processing equipment for performing surface chemical treatment on semiconductor wafers and an online fault detection method thereof. [0003] 【Background technique】 [0004] At present, integrated circuit electronic products are widely used in many fields, such as computers, communications, industrial control and consumer electronics. The manufacturing of integrated circuits has become a basic industry as important as steel. [0005] Wafers are the carriers used to produce integrated circuits. The wafers that need to be prepared in actual production must have a flat, ultra-clean surface, and the existing methods for preparing ultra-clean wafer surfaces can be divided into two categories: wet processes such as immersion and spray techniques, and Dry processes such as chemical vapor and plasma based technologies. Among them, the wet processi...

AI Technical Summary

Problems solved by technology

Once the components in each system such as pumps and valves fail, such as the valves cannot be opened and closed normally, it will affect the cleaning effect of the wafer, thereby affecting the yield of the product. Therefore, 50% of the yield problems on the production line are related to the cleaning process

Usually, real-time monitoring and regular maintenance are required for all system components, but due to too many system components, it is difficult to ensure that every problematic component can be found in time

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