Package apparatus and manufacturing method thereof

Abstract

A package apparatus comprises a first wiring layer, a first conductive pillar layer, a first molding compound layer, a second wiring layer, and a protection layer. The first wiring layer has a first surface and a second surface that are arranged opposite to each other. The first conductive pillar layer is disposed on the second surface of the first wiring layer, whereas the first conductive pillar layer is a non-circular conductive pillar layer. The first molding compound layer is disposed within a specific portion of the first wiring layer and the first conductive pillar layer. The second wiring layer is disposed on the first molding compound layer and one end of the first conductive pillar layer. The protection layer is disposed on the first molding compound layer and the second wiring layer.

Description

technical field [0001] The invention relates to a packaging device and a manufacturing method thereof, in particular to a semiconductor packaging device and a manufacturing method thereof. Background technique [0002] In the new generation of electronic products, the constant pursuit of thinner, lighter and smaller products requires multi-functional and high-performance products. Therefore, integrated circuits (Integrated Circuit, IC) must accommodate more electronic components in a limited area to achieve high density and high performance. To meet the requirements of miniaturization, the electronics industry has developed a new packaging technology for this purpose. Electronic components are embedded in the substrate, which greatly reduces the volume of the structure and shortens the connection path between electronic components and the substrate. In addition, it can also use the build-up technology (Build-Up ) to increase the wiring area to meet the trend of thin, light, ...

AI Technical Summary

Problems solved by technology

[0004] The above-mentioned traditional glass fiber substrate packaging structure 10 can only form the circular conductive column layer 120 with circular via holes by using the physical mechanism of mechanical drilling or laser drilling. However, the circular conductive column layer 120 has a larger The cross-sectional area will cause certain restrictions on the production of substrates with high-density wiring, making the cost of substrates too expensive to compete with industrial advantages

Images