Heat dissipation structure and manufacturing method
A technology of a heat dissipation structure and a manufacturing method, which is applied in the directions of printed circuit manufacturing, circuit thermal devices, lighting and heating equipment, etc., can solve the problems of low thermal conductivity of solder pads and adhesive layers, unfavorable system heat dissipation, etc.
Inactive Publication Date: 2016-02-17
SHUNSIN TECH (ZHONG SHAN) LTD
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Problems solved by technology
However, the thermal conductivity of the solder pad and the bonding layer is low, which is not conducive to the heat dissipation of the system
Method used
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Embodiment Construction
[0029] Please refer to figure 1 , The heat dissipation structure 100 of the present invention includes a heat dissipation substrate 10 , a printed circuit board 20 , a filling material 26 and an electronic component 30 . In this embodiment, the electronic component 30 is an LED light source. The electronic components 30 generate heat during operation. The printed circuit board 20 is printed on the heat dissipation substrate 10 by screen printing and sintering process, the printed circuit board 20 has a through hole 22, and the filling material 26 fills the through hole 22. The filling material 26 is a conductive and thermally conductive material. On the circuit board 20 and covering the through hole 22 , the heat generated by the electronic component 30 is conducted to the heat dissipation substrate 10 through the filling material 26 for heat dissipation.
[0030] Specifically, the heat dissipation substrate 10 is a heat dissipation fin made of aluminum, which is in a rectan...
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The invention provides a heat dissipation structure. The heat dissipation structure comprises a heat dissipation substrate, a printed circuit board and an electronic element. The electronic element generates heat in the working process. The printed circuit board makes contact with the first surface of the heat dissipation substrate. The printed circuit board is provided with a through hole. The electronic element is located on one side, far away from the first surface, of the printed circuit board and covers the through hole. The through hole is filled with a filling material. The filling material is an electricity and heat conducting material. The heat generated by the electronic element is conducted to the heat dissipation substrate through the filling material for heat dissipation. The invention further discloses a manufacturing method of the heat dissipation structure. According to the heat dissipation structure and the manufacturing method, the through hole of the printed circuit board is filled with the electricity and heat conducting filling material, so that the heat generated by the electronic element is transmitted to the heat dissipation substrate through the filling material for heat dissipation, and the heat dissipation performance of a system is improved.
Description
technical field [0001] The invention relates to an electronic component, in particular to a heat dissipation structure of the electronic component and a manufacturing method thereof. Background technique [0002] Currently, a light emitting diode (Light-emitting diode, LED) is widely used as a green light source in the lighting field. Compared with ordinary incandescent lamps, LED has many advantages such as low power consumption and long life. However, when the LED is in use, about 80% of the electric energy is converted into heat energy. If the heat cannot be dissipated in time, the luminous efficiency of the LED will decrease due to the high working temperature and the service life of the LED will be seriously reduced. [0003] The existing heat dissipation structure usually includes a heat dissipation substrate, a printed circuit board and an adhesive layer connecting the printed circuit board and the heat dissipation substrate. The LED is electrically connected to the...
Claims
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IPC IPC(8): F21V29/00F21Y101/02
CPCH05K1/053H05K3/0061H05K1/0206H05K1/181H05K2201/10106
Inventor 李顺隆黄洪光
Owner SHUNSIN TECH (ZHONG SHAN) LTD