Power semiconductor modules with integrated current sensor core

Abstract

A power semiconductor module with an integrated current sensor magnetic core, including an output electrode, a sampling control terminal, a bottom plate, a ceramic substrate, and a casing, the output electrode is connected to an output electrode arm arranged parallel to the direction of the bottom plate, and the output electrode arm is connected to the ceramic The substrates are connected, the output electrode arm is covered with a sensor core, the sensor core has an upward core opening, and the shell is provided with an insertion hole at a corresponding position above the core opening. The present invention integrates the magnetic core of the current sensor inside the power semiconductor module. When current sampling is required, it is only necessary to insert a Hall element at the opening of the magnetic core, omitting the installation of the current sensor outside the power semiconductor module in the prior art. The steps increase the integration, miniaturization and stability of the control system, and reduce the cost of subsequent use.

Description

Technical field [0001] The invention relates to the field of power electronics, in particular to a power semiconductor module integrated with a magnetic core of a current sensor. Background technique [0002] The topological structure of the power semiconductor module is single-tube, two-unit, six-unit, etc., which can be combined into a half-bridge, three-phase full bridge and other circuit forms as needed. In actual use, it is often necessary to obtain the output current value. [0003] The traditional power semiconductor module does not have the current sampling function. Therefore, when the output current needs to be measured, it is necessary to connect the AC output electrode of the power semiconductor module to the busbar, and install a current sensor on the busbar to transmit the sampled electrical signal Give the control part. [0004] The disadvantage of this solution is that the installation of the current sensor on the busbar takes up a lot of space, and sometimes it is ...

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Problems solved by technology

[0004] The disadvantages of this solution are: installing the current sensor on the busbar takes up a lot of space, and sometimes it is even necessary to bend the busbar to match the installation of the current sensor. When the current value does not need to be measured, the circuit needs to be cumbersomely removed. This method is not only not conducive to the miniaturization of the system, but also has troublesome installation, high cost and slow response speed.

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