Systems and methods for laser scanning hermetically sealed glass packages

A laser scanning and sealing glass technology, which is applied in the manufacture of electric solid devices, semiconductor devices, semiconductor/solid devices, etc., can solve the problem of uneven temperature field distribution of glass frit, and achieve the effect of improving the uneven distribution of temperature field

Active Publication Date: 2018-01-26
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The object of the present invention is to provide a system and method for laser scanning and sealing glass packages, which are used to seal OLED displays or glass packages, which can solve the problem of uneven temperature field distribution of the glass frit, and meanwhile, it has a wider Process window, conducive to improving OLED display yield

Method used

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  • Systems and methods for laser scanning hermetically sealed glass packages
  • Systems and methods for laser scanning hermetically sealed glass packages
  • Systems and methods for laser scanning hermetically sealed glass packages

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Experimental program
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Embodiment 1

[0051] Please refer to figure 2 with image 3 In this embodiment, a laser scanning system for sealing a glass package is proposed, which is used to form an airtight seal with frit for the OLED display 120. The OLED display 120 is a typical glass package. The main structure of the display 120 includes a cover glass 121, a glass frit 122, a substrate glass 123, an OLED layer 125 and an electrode 124. Wherein, the glass frit 122 is located on the substrate glass 123 of the OLED display 120, and its cross-sectional view is as image 3 As shown in the top view figure 2 Shown. The glass frit 122 is pre-cured on the substrate glass 123 through screen printing and pre-sintering steps to form a rounded rectangular sealing line with a certain thickness. The OLED layer 125 on the substrate glass 123 is located inside the sealing line of the frit 122, and at the same time, there are electrodes 124 on the substrate glass 123 connecting the inside and outside of the OLED display 120.

[005...

Embodiment 2

[0067] Please refer to Figure 8 In this embodiment, compared to the first embodiment, the proposed laser scanning sealing glass package system has an additional temperature measurement module, and the temperature measurement module is connected to the controller module for measuring the laser irradiation to the glass frit. The real-time temperature of the light spot on the surface is fed back to the controller module. The temperature measurement module can non-contact and real-time measure the temperature of the glass frit 122 at the position of the light spot 110 and feed it back to the controller module. One feature is that when the light spot 110 moves at a high speed, the temperature measurement The module still has enough time / spatial resolution to measure the temperature of the frit 122 where the light spot 110 is located. The controller module can collect and process the temperature signal feedback from the temperature measurement module, and form a closed loop control ...

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Abstract

The present invention proposes a system and method for laser scanning and sealing a glass package. The laser scanning module can quickly and periodically scan the laser on the glass frit, so that the glass frit can be heated more uniformly and synchronously, improving the prior art The problem of uneven temperature field distribution during the packaging process; in the proposed method of laser scanning and sealing the glass package, the laser module can emit laser light with a predetermined power curve, so that the heating process of the glass frit can be controlled according to the predetermined power curve. Furthermore, the added temperature measurement module can measure and feed back the real-time temperature of the glass frit surface, and the glass frit can be heated or cooled according to a predetermined temperature rise or temperature drop curve by means of preset temperature rise or preset temperature drop.

Description

Technical field [0001] The invention relates to the field of optoelectronic semiconductors, and in particular to a system and method for laser scanning and sealing a glass package. Background technique [0002] Optoelectronic semiconductor devices have been widely used in various fields of life. Among them, OLED (Organic Light Emitting Diode) has become a research hotspot due to its good color ratio, wide viewing angle, and high response speed, and has good application prospects. However, the electrodes and organic layers in OLED displays are very sensitive to oxygen and moisture. Oxygen and moisture that penetrate into the OLED device from the external environment will seriously shorten the life of the OLED device. Therefore, it is very important to provide effective hermetic sealing for OLED devices. Some factors that make it difficult to properly seal OLED devices are discussed below: [0003] ·The airtight seal should provide oxygen (10 -3 cm 3 / m2 / day) and water (10 -6 g / m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/56
CPCH10K71/421H10K59/87
Inventor 黄元昊朱树存罗闻程蕾丽
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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