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Quasi-synchronous laser packaging system and method

A laser encapsulation, quasi-synchronized technology, applied in electrode system manufacturing, discharge tube/lamp manufacturing, electrical components, etc., can solve problems such as uneven temperature field distribution, improve temperature uniformity, uniform heating, and achieve precise control Effect

Active Publication Date: 2019-06-25
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0011] The purpose of the present invention is to provide a quasi-synchronous laser packaging system and method, which solves the problem of uneven temperature field distribution during the closed-loop quasi-synchronous packaging of the above-mentioned glass frit, and is conducive to improving the packaging quality of OLED displays

Method used

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  • Quasi-synchronous laser packaging system and method
  • Quasi-synchronous laser packaging system and method

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Embodiment 1

[0055] Please refer to figure 1 , which is a schematic structural diagram of the quasi-synchronous laser packaging system provided by Embodiment 1 of the present invention. The quasi-synchronous laser packaging system is used to seal glass packages, such as figure 1 As shown, the quasi-synchronous laser packaging system includes: a controller module 110, a laser module 111, a laser scanning module 112, a temperature measurement control module 113, and a host computer 114; wherein the laser module 111 is used to emit a laser beam 103 and transmitted to the laser scanning module 112; the laser scanning module 112 is used to project the laser beam 103 on the frit 122, and scan the frit along the sealing line; the temperature measurement control module 113 is used to measure The temperature of the glass frit 122 corresponding to the irradiation place of the laser spot at one or more times, outputting the laser power control signal 104 to the controller module 110; the controller ...

Embodiment 2

[0077] On the basis of the first embodiment, this embodiment provides a more specific quasi-synchronous laser packaging system and method.

[0078] Please refer to Figure 4 , which is a schematic structural diagram of the quasi-synchronous laser packaging system provided by Embodiment 2 of the present invention. Such as Figure 4 As shown, the quasi-synchronous laser packaging system includes: a scanning controller 10 , a laser 11 , a pyrometer 12 , a pyrometer controller 13 , a scanning vibrating mirror 14 and a computer (PC) 15 . Wherein, the scanning controller 10, the laser 11, the pyrometer 12, the pyrometer controller 13, the scanning vibrating mirror 14, and the computer (PC) 15 are respectively equivalent to the controller module, the laser module, and the temperature measurement module described in Embodiment 1. The sub-concepts of the control module, the laser scanning module and the host computer 114. The laser 11 is connected to the scanning galvanometer 14 thr...

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Abstract

The invention provides a quasi-synchronous laser packaging system and a method thereof. The system comprises a controller module, a laser device module, a laser scanning module, a temperature measurement control module and an upper computer. Through correcting a laser power control signal which is output from the temperature measurement control module in a single scanning period by the controller module, not only can a requirement for airtight sealing of an OLED display device be satisfied, but also change of laser output power can be controlled in a single scanning period. The quasi-synchronous laser packaging system and the method thereof have advantages of improving temperature homogeneity at the corner of a sealing wire, realizing relatively synchronous heating of a glass material, and realizing accurate control to a temperature curve of the glass material.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a quasi-synchronous laser assembly system and method. Background technique [0002] Optoelectronic semiconductor devices have been widely used in various fields of life. Among them, due to its good color ratio, wide viewing angle, high response speed and other characteristics, OLED has become a research hotspot and has a good application prospect. However, the electrodes and organic layers in OLED displays are very sensitive to oxygen and moisture, and oxygen and moisture permeating into OLED devices from the external environment will seriously shorten the life of OLED devices. Therefore, it is very important to provide an effective hermetic seal for OLED devices. [0003] The main factors affecting the hermetic sealing of OLED devices are: [0004] The hermetic seal shall provide protection against oxygen (10 -3 cm 3 / rice 2 / day) and water (10 -6 g / m 2 / day) barr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01J9/26
CPCH01J9/241H01J9/26
Inventor 黄元昊
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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