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Method for producing an optoelectronic component

A technology of optoelectronic devices and optoelectronic semiconductors, which is applied in the direction of electrical components, semiconductor devices, circuits, etc., can solve the problem that wavelength conversion components do not have outer edges, etc., and achieve the effect of less material waste, large degrees of freedom, and providing degrees of freedom

Active Publication Date: 2016-02-17
OSRAM OPTO SEMICONDUCTORS GMBH & CO OHG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the wavelength converting elements thus obtainable do not have clearly defined outer edges

Method used

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  • Method for producing an optoelectronic component
  • Method for producing an optoelectronic component
  • Method for producing an optoelectronic component

Examples

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Embodiment Construction

[0039] figure 1 A schematic cross-sectional illustration of a wafer assemblage 150 with a plurality of optoelectronic semiconductor chips 100 is shown. Wafer assemblage 150 is designed as a flat sheet (wafer) in which optoelectronic semiconductor chips 100 are arranged side by side in a lateral direction, for example in a two-dimensional matrix. Each optoelectronic semiconductor chip 100 has a top side 101 and a bottom side 102 opposite top side 101 . The upper sides 101 of the optoelectronic semiconductor chips 100 together form the upper side of the crystal composite 150 . The undersides 102 of the optoelectronic semiconductor chips 100 together form the underside of the wafer assembly 150 .

[0040] The optoelectronic semiconductor chip 100 may be, for example, a light-emitting diode chip (LED chip). The optoelectronic semiconductor chip 100 may be, for example, a light-emitting diode chip which is provided to emit electromagnetic radiation (visible light) having a wavelen...

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Abstract

The invention relates to a method for producing an optoelectronic component which comprises steps for providing an optoelectronic semiconductor chip (100) having a mask layer (200) arranged on a top side of the optoelectronic semiconductor chip, for providing a carrier (300) having walls (320) arranged on a surface of the carrier, which walls laterally bound an accommodating region, for arranging the optoelectronic semiconductor chip in the accommodating region, wherein a bottom side of the optoelectronic semiconductor chip faces the surface of the carrier, for filling a region of the accommodating region surrounding the optoelectronic semiconductor chip with an optically reflective material (400) up to a height that lies between the top side of the optoelectronic semiconductor chip and a top side of the mask layer, for removing the mask layer in order to create a free space in the optically reflective material, and for introducing a wavelength-converting material (500) into the free space.

Description

technical field [0001] The invention relates to a method for producing an optoelectronic component according to patent claim 1 . [0002] This patent application claims priority from German patent application 102013212928.9, the disclosure content of which is hereby incorporated by reference. Background technique [0003] In optoelectronic components with optoelectronic semiconductor chips, for example light-emitting diode components with light-emitting diode chips (LED chips), it is known to arrange the wavelength conversion element on the radiation-emitting upper side of the optoelectronic semiconductor chip. Such a wavelength conversion element is also called a chip level converter (Chip Level Converter, CLC). The wavelength conversion elements are used here in each case to convert the wavelength of electromagnetic radiation emitted by the optoelectronic semiconductor chip in order to generate electromagnetic radiation of one or more other wavelengths, for example visibl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L33/50H01L33/60H01L33/48
CPCH01L33/505H01L33/005H01L33/486H01L33/502H01L33/60H01L33/62H01L2933/0033H01L2933/0041H01L2933/0058H01L2933/0066
Inventor M.布兰德尔M.布格尔
Owner OSRAM OPTO SEMICONDUCTORS GMBH & CO OHG