Copper-clad plate hydroforming device

A technology of hydroforming and copper-clad laminates, which is applied in lamination devices, lamination, and control lamination, etc., can solve the problems of high molding pressure, poor uniformity, and high product warpage, and achieve reduced resin curing and low warpage Small, less prone to white spots

Inactive Publication Date: 2016-02-24
JIAXING CENTURY ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the hot pressing process is completed in air or vacuum, the forming pressure is relatively high, and the lamination force on the surface of the copper clad laminate is not uniform, which leads to high warpage and poor uniformity of the pressed product.

Method used

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  • Copper-clad plate hydroforming device
  • Copper-clad plate hydroforming device

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Embodiment Construction

[0022] The following are specific embodiments of the present invention and the accompanying drawings to further describe the technical solutions of the present invention, but the present invention is not limited to these embodiments.

[0023] In order to overcome the shortcomings of the prior art, please refer to figure 1 and figure 2 , shown is a schematic structural diagram of a hydroforming device for a copper clad laminate provided by an embodiment of the present invention, including a pressing container 1 and a control device 2 ( figure 1 (not shown), the press-fit container includes a press-fit container body 11 and a container cover 12 made of sturdy, wear-resistant and corrosion-resistant cast steel materials, and the press-fit container body 11 and the container cover 12 have a tight fit with each other. Closed structure, the container cover 12 is closed to form a closed space, which can ensure that the lamination container is in a closed state during the lamination...

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Abstract

The invention provides a copper-clad plate hydroforming device. The device comprises a pressure vessel and a control device which is arranged on the outer wall of the pressure vessel and is used for controlling a pressure vessel lamination process. A vacuum bag is arranged in the main body of the pressure vessel. Multiple copper-clad plates to be subjected to lamination molding are arranged in the vacuum bag. The bottom of the main body of the pressure vessel is provided with a heating device. The inner wall of the main body of the pressure vessel is provided with multiple temperature sensors. The heating device and the temperature sensor are electrically connected to the control device. The pressure vessel is filled with a liquid medium, forms a sealed space and applies uniform pressure for the vacuum bag. The control device controls the heating device to heat the liquid medium so that a lamination process is finished. The copper-clad plates are laminated in the liquid medium in the sealed container so that the surface of the sample to be subjected to lamination is subjected to uniform pressing. The pressed product has a small warping degree and a less plate resin solidification amount and does not easily produce white spots, cracks, layer bubbles, gaps and pits.

Description

technical field [0001] The invention relates to the technical field of copper clad laminate preparation, in particular to a hydroforming device for copper clad laminates. Background technique [0002] Copper clad laminates (Copper Clad Laminates) are substrate materials used to manufacture printed circuit boards (PCBs). In the prior art, they are usually formed by composite hot pressing of substrates, insulating medium adhesive layers and copper foils. Since the hot pressing process is completed in air or vacuum, the molding pressure is relatively large, and the lamination force on the surface of the copper clad laminate is not uniform, which leads to high warpage and poor uniformity of the pressed product. [0003] Therefore, in view of the above-mentioned defects in the current prior art, it is necessary to conduct research to provide a solution to solve the defects in the prior art. SUMMARY OF THE INVENTION [0004] In order to solve the problems existing in the prior ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/10B32B37/06B32B37/12B32B41/00B32B15/20B32B15/04
CPCB32B37/10B32B15/04B32B15/20B32B37/06B32B37/12B32B41/00B32B2457/08
Inventor 计志峰
Owner JIAXING CENTURY ELECTRONICS
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