Package substrate and manufacturing method thereof

Abstract

The invention discloses a package substrate and a manufacturing method thereof. The manufacturing method comprises the following steps: providing a first light sensitive dielectric layer provided with a first surface and a second surface, wherein the first surface is opposite to the second surface; forming a plurality of conductive columns that penetrate the first surface and second surface in the first light sensitive dielectric layer; and forming a circuit layer, which is electrically connected to the conductive columns, on the first surface of the first light sensitive dielectric layer. Due to the light sensitive dielectric layer, the manufacturing is simplified, and the production cost is reduced.

Description

technical field [0001] The present invention relates to a packaging substrate and its manufacturing method, especially to a packaging substrate using photosensitive dielectric material and its manufacturing method. Background technique [0002] With the vigorous development of the electronics industry, many high-end electronic products are gradually developing towards light, thin, short, small and other high-density directions, and with the evolution of packaging technology, chip packaging technology is becoming more and more diversified. Therefore, the size or volume of the semiconductor package is also continuously reduced, so as to make the semiconductor package thinner and smaller. [0003] The structure of a general packaging substrate is composed of stacked copper layers and glass fiber layers (the material is FR-X, CEM-X). Generally speaking, there are two ways to make conductive through holes or conductive blind holes of the packaging substrate. : The first way is t...

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Problems solved by technology

[0013] However, in the manufacturing method of the above packaging substrate, an unpatterned copper layer must be formed on the core board first, and then a patterned photoresist layer is formed on the copper layer before the copper layer can be patterned.

[0014] In addition, the above manufacturing method uses mechanical drilling or laser drilling. Although mechanical drilling can be penetrated at one time, it has the effect of saving man-hours; For density wiring products or apertures smaller than 100μm, laser drilling must be used

[0015] Although laser drilling has the advantage of being able to produce smaller apertures, the cost of laser drilling is expensive. Therefore, when making substrates, laser drilling processes are generally avoided as much as possible.

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