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Ceramic quadrilateral leadless flat packaging shell used for integrated circuit packaging

A four-side leadless, integrated circuit technology, used in circuits, electrical components, electrical solid devices, etc., can solve the problems of reliability defects such as package air tightness, internal thermal characteristics storage, application, etc. The effect of high air tightness and high mechanical reliability

Inactive Publication Date: 2016-03-02
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Its main features are simple process and low cost, but it is generally regarded as a non-hermetic package, and there are relatively large defects in the reliability of package airtightness, internal thermal characteristics, storage, application, etc.

Method used

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  • Ceramic quadrilateral leadless flat packaging shell used for integrated circuit packaging
  • Ceramic quadrilateral leadless flat packaging shell used for integrated circuit packaging
  • Ceramic quadrilateral leadless flat packaging shell used for integrated circuit packaging

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Embodiment Construction

[0021] The technical solutions in the embodiments of the present invention are clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0022] In the following description, a lot of specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, and those skilled in the art can do it without departing from the meaning of the present invention. By analogy, the present invention is therefore not limited to the specific examples disclosed below.

[0023] Such as Figure...

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Abstract

The invention discloses a ceramic quadrilateral leadless flat packaging shell used for integrated circuit packaging, and relates to the technical field of a packaging shell of electronic components and parts. The shell comprises a ceramic member and a cover plate. The ceramic member has a container-shaped structure of which the upper end is open. The opening of the upper end of the ceramic member is sealed by the cover plate. The ceramic member comprises a bottom plate and side walls. The internal wall of the side walls is provided with multiple pin bonding PADs in a spacing way. The lower surface of the shell is provided with multiple external lead-out ends in the spacing way. The pin bonding PADs are connected with the corresponding external lead-out ends via respective first connecting metal wires in the side walls. The shell has characteristics of multilayer wiring, high reliability and high airtightness and is mature in preparation technology so that miniaturization can be realized, and the miniaturized packaging requirement of large-size chips and bonding of multiple PADs can be met.

Description

technical field [0001] The invention relates to the technical field of packaging casings for electronic components, in particular to a ceramic quadrilateral leadless flat packaging casing for integrated circuit packaging. Background technique [0002] Conventional plastic-encapsulated QFN housings (such as figure 1 As shown), it is a structure of epoxy molding compound + frame lead (mostly copper material). The main process of plastic packaging includes silicon wafer thinning, slicing, chip mounting, wire bonding, transfer molding, post-curing, deburring, soldering, rib cutting and bending, etc. Its main features are simple process and low cost, but it is generally regarded as a non-hermetic package, and has relatively large defects in terms of package airtightness, internal thermal characteristics, storage, application and other reliability. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a ceramic four-sided ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/04
CPCH01L2224/48091H01L2224/48227H01L2224/48247H01L2924/00014
Inventor 彭博杨振涛张倩于斐张旭赵璐
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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