Film preparation device, preparation method, and flip-chip LED chip preparation method

A technology for LED chips and preparation devices, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of unfavorable automatic LED chip production and large limitations, and achieve the effects of saving space, easy automation, and realizing automation

Active Publication Date: 2018-03-06
FOSHAN EVERCORE OPTOELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the existing glue dispensing process directly realizes the curing of the glue by heat (for example, the glue is cured by the heat in the oven), which has great limitations; at the same time, during the curing process, the LED chip needs to enter the oven together with the glue. Curing is not conducive to the production of automated LED chips

Method used

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  • Film preparation device, preparation method, and flip-chip LED chip preparation method
  • Film preparation device, preparation method, and flip-chip LED chip preparation method
  • Film preparation device, preparation method, and flip-chip LED chip preparation method

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Embodiment Construction

[0032] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings. It is only stated here that the words for directions such as up, down, left, right, front, back, inside, and outside that appear or will appear in the text of the present invention are only based on the accompanying drawings of the present invention, and are not specific to the present invention. limited.

[0033] see figure 1 , figure 1 It shows the first embodiment of the preparation device 100 for the adhesive film of flip-chip LED chips according to the present invention. The preparation device 100 includes a light-transmitting substrate 1 and a light-emitting device 2 arranged under the light-transmitting substrate 1. The light-transmitting A light-absorbing component 3 is provided on the upper surface of the substrate 1, and the shape of the light-absorbing ...

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Abstract

The invention discloses a preparation apparatus of a flip LED chip glue film. The preparation apparatus comprises a light transmission substrate and a light-emitting device arranged under the light transmission substrate. The upper surface of the light transmission substrate is provided with a light absorbing component. The light of the light-emitting device may transmit the light transmission substrate to irradiate the light absorbing component. The shape of the light absorbing component is the same as the molded pattern of the glue film. The invention also discloses a preparation method of a flip LED chip glue film and a preparation method of a flip LED chip. Fluorescent glue is solidified in a light-thermal-solid manner so that a good flexibility is achieved. Further, in a solidification process, the LED chip is not required to be solidified by entering a baking oven along with the fluorescent glue so that automation is easier to achieve.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to a preparation device for an adhesive film for flip-chip LED chips, a preparation method for the adhesive film for flip-chip LED chips, and a preparation method for flip-chip LED chips. Background technique [0002] With the rapid development of the semiconductor industry, the application range of packaging technology is becoming wider and wider, and the packaging forms are becoming more diversified. Among them, flip-chip technology (Flip-Chip), also known as "inverted chip packaging" or "inverted chip packaging method", is not only a chip interconnection technology, but also an ideal chip bonding technology. Compared with traditional packaged light sources, LED light sources supported by flip-chip technology have the characteristics of low thermal resistance, low voltage, high current density and high light efficiency. Comprehensive research shows that flip-chip LED light s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/52H01L33/50
CPCH01L33/50H01L33/52H01L2933/0041H01L2933/005
Inventor 王孟源朱思远董挺波
Owner FOSHAN EVERCORE OPTOELECTRONICS TECH
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