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FPGA chip and manufacturing method thereof

A manufacturing method and chip technology, which are applied in the fields of semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., to achieve the effects of improving chip integration, increasing utilization, and reducing implementation costs

Inactive Publication Date: 2016-03-09
SHANGHAI XINCHU INTEGRATED CIRCUIT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

For example, in the traditional planar NAND flash memory, the floating gate transistor of the storage unit is a planar transistor, and all the source terminals and the drain terminals are located on the same plane, while the 3D NAND storage unit uses a three-dimensional transistor, and its source terminals and drain terminals are located on different planes. , so the storage density is higher, but the density of the memory chip can even reach the order of hundreds of gigabytes

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  • FPGA chip and manufacturing method thereof
  • FPGA chip and manufacturing method thereof
  • FPGA chip and manufacturing method thereof

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Embodiment Construction

[0023] The present invention proposes a method for realizing an FPGA chip based on a 3D non-volatile memory, and the basic structural diagram of the chip is as follows Figure 5 shown. Wherein, the left side is a three-dimensional perspective view of the FPGA chip of the present invention, and the right side is a longitudinal cross-sectional view of the FPGA chip of the present invention. A memory array on a silicon chip to implement 3D non-volatile memory (NVM). The storage array of the 3D nonvolatile memory may be a 3D NAND flash storage array, a 3D phase change memory storage array, a 3D magnetic memory storage array, a 3D ferroelectric memory storage array, a 3D resistive variable memory storage array, and the like. The storage array of the 3D non-volatile memory in the present invention can store configuration information (configuration context) of the FPGA, can also be used as a programming unit of the FPGA, and can also be used as a storage block (memory block) of the ...

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Abstract

The invention discloses method for manufacturing an FPGA chip based on a 3D nonvolatile memory. Specifically, a 3D nonvolatile memory array is realized on a silicon chip, and apart from manufacturing a peripheral circuit of the 3D nonvolatile memory on a silicon substrate, an FPGA logic circuit is manufactured at the same time. The implementation method of the FPGA chip based on the 3D nonvolatile memory integrates the 3D nonvolatile memory and an FPGA on one chip, the area of the silicon chip is fully utilized, and the integration level of the chip is greatly improved, thereby reducing implementation cost of the FPGA.

Description

technical field [0001] The invention relates to the field of FPGA chip design, in particular to an FPGA chip based on a 3D non-volatile memory and a manufacturing method thereof. Background technique [0002] FPGA is Field Programmable Gate Array, which is a semi-custom circuit in the field of special circuits, which not only solves the shortcomings of custom circuits, but also overcomes the shortcomings of the limited number of original programmable device gates. An existing FPGA chip implementation is as figure 1 As shown, a static random access memory (SRAM) is used as a programming unit (programbit), and configuration information in the form of a bitstream (bitstream) exists in an external non-volatile memory. Every time the power is turned on, the configuration information needs to be programmed from the external non-volatile memory into the corresponding programming unit. This kind of FPGA chip is low in cost and simple to implement, but there are security risks, and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/115H01L27/112H01L21/8247H10B69/00
CPCH10B20/60H10B69/00
Inventor 景蔚亮陈邦明
Owner SHANGHAI XINCHU INTEGRATED CIRCUIT