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Electromagnetic wave shielding film and method for producing flexible printed wiring board with same

A flexible printing and shielding film technology, applied in the fields of magnetic field/electric field shielding, printed circuit parts, electrical components, etc., can solve the problem of inability to cut off the insulating adhesive layer of the peeling film

Inactive Publication Date: 2018-06-29
SHIN-ETSU POLYMER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0017] However, in these electromagnetic wave shielding films, although the insulating resin layer containing the colorant can be cut by laser light, the peeling film and the insulating adhesive layer cannot be cut.

Method used

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  • Electromagnetic wave shielding film and method for producing flexible printed wiring board with same
  • Electromagnetic wave shielding film and method for producing flexible printed wiring board with same
  • Electromagnetic wave shielding film and method for producing flexible printed wiring board with same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0210] As the first release film 18, a white polyethylene terephthalate film (manufactured by Toyobo Co., Ltd., Crisper, thickness: 50 μm, in the Storage modulus at 160°C: 3.5×10 8 Pa, white pigment: 2.5% by mass, thickness of release agent layer 18b: 0.12 μm).

[0211] Process (a):

[0212] On the release agent layer 18b surface of the first release film 18, a solvent-soluble amide resin (manufactured by T&K Donghua Co., Ltd., TPAE-617C), a curing agent (toluene diisocyanate) and a black pigment (manufactured by Mitsubishi Chemical Corporation, Carbon black #25 for color) is dissolved or dispersed in N,N-dimethylformamide, heated at 150°C for 0.4 hours to cure the amide resin and form a protective layer 12 (thickness: 5 μm, at 160°C Storage modulus: 8.3×10 6 Pa, black pigment: 1.8% by mass, surface resistance: 9×10 12 Ω).

[0213] Process (b):

[0214] Copper was physically vapor-deposited on the surface of the protective layer 12 by electron beam vapor deposition to fo...

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PUM

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Abstract

Provided is an electromagnetic wave shielding film and a method for manufacturing a flexible printed wiring board with an electromagnetic wave shielding film using the electromagnetic wave shielding film, wherein the electromagnetic wave shielding film uses laser energy to convert at least a first release film, a protective layer, and a metal thin film layer And the whole anisotropic conductive adhesive layer is cut. Use electromagnetic wave shielding film (10), this electromagnetic wave shielding film (10) has the first release film (18) that contains coloring agent, the protective layer (12) that contains coloring agent, metal thin film layer (14) and contains dyestuff and An anisotropic conductive adhesive layer (16) having conductivity in the thickness direction.

Description

technical field [0001] The present invention relates to an electromagnetic wave shielding film and a method for manufacturing a flexible printed wiring board provided with the electromagnetic wave shielding film. Background technique [0002] In order to shield electromagnetic noise generated from a flexible printed wiring board and electromagnetic noise from the outside, an electromagnetic wave shielding film may be provided on the surface of the flexible printed wiring board. (For example, refer to Patent Document 1). [0003] Image 6 It is a sectional view which shows an example of the manufacturing process of the conventional flexible printed wiring board with an electromagnetic wave shielding film. [0004] The flexible printed wiring board 101 with an electromagnetic wave shielding film has the electromagnetic wave shielding film 110 which peeled the flexible printed wiring board 130, the insulating film 140, and the mold release film 118 off. [0005] Flexible prin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K9/00H05K1/02
Inventor 川口利行
Owner SHIN-ETSU POLYMER CO LTD