Making technology of sensor packaging sheet

Abstract

The invention discloses a making technology of a sensor packaging sheet. By using the making technology, a process is simple, a degree of freedom is high and production precision is high too. A technical scheme is characterized by a) selecting an upper substrate, a lower substrate and several chips and carrying out pre-processing; b) coating a first adhesive material on a bottom surface of the upper substrate and successively carrying out exposure, PEB and development on the first adhesive material; c) carrying out alignment and attaching on the bottom surface of the upper substrate and a top surface of the lower substrate; d) selecting a plurality of chips, wherein the lower substrate is provided with several placing holes and the chips pass through the placing holes from a bottom surface of the lower substrate to the top surface and carry out alignment and attaching with the bottom surface of the upper substrate; e) carrying out whole plate lamination on the upper substrate, the lower substrate and the chips after attaching to obtain a semi-finished product A; f) attaching a top surface of the semi-finished product A to several optical filters and processing a reinforced layer on a bottom surface to obtain a semi-finished product B; g) carrying out solidification on the first adhesive material after the step e or the step f. The whole making technology has high precision and the process is simple.

Description

technical field [0001] The invention relates to the packaging field, and more specifically relates to a manufacturing process of a sensor packaging sheet. Background technique [0002] The packaging of most camera chips is based on the flip-chip technology, which has the following advantages: Compared with the traditional COB-based packaging, this method greatly improves the efficiency due to the removal of the wire-bond link; In addition, the package is packaged in a contiguous manner, and the efficiency can be further improved, and the production method of the substrate is similar to that of a general circuit board, which can effectively reduce equipment costs and material costs. However, at present, photosensitive sheets, chips, and multiple substrates need to be laminated multiple times when they are packaged, and after lamination, they need to be laminated, and the production process is complicated. Contents of the invention [0003] The technical problem to be solve...

AI Technical Summary

Problems solved by technology

However, at present, when packaging photosensitive sheets, chips, and multiple substrates, multiple laminations are required, and lamination is performed after lamination. The production process is complicated.

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