Rigid-flex PCB with flexible region equipped with solder pad and manufacturing method thereof

A technology of rigid-flex board and flexible area, applied in the field of rigid-flex board, can solve the problems of time-consuming and laborious, low overall efficiency, and many consumables, so as to reduce production costs, reduce the number of immersion gold, and simplify the process flow. Effect

CN105430899AActive Publication Date: 2016-03-23HUIZHOU KING BROTHER CIRCUIT TECH +2
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Publication Date
2016-03-23

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Abstract

The invention discloses a rigid-flex PCB with a flexible region equipped with a solder pad and a manufacturing method thereof. The manufacturing method includes the steps that raw materials of a pre-process flexible board, a PP prepreg and a rigid board are manufactured, manufacturing of internal wiring of the flexible board is completed to a quick pressing cover film, laser winding processing and quick pressing adhesive resistance processing of the cover film are performed on the cover film, and the flexible board with a copper solder pad and the prepreg and the rigid board are laminated together from the top to the bottom in turn and then transferred to a board lamination pressing process to perform total pressing processing; after total pressing processing is completed, the process goes to an external layer solder resistance process according to the conventional process; then flexible board region de-cap processing and manufacturing a flexible board framework are performed, the copper surface is cleaned by an abrasive blasting mode, and then internal and external solder pad synchronous gold immersion processing is performed on the flexible region solder pad and an external solder pad; and finally CNC rigid board formation processing is performed on a rigid board framework so that a finished board meeting the profile dimension required by a client can be obtained. The rigid-flex PCB with the flexible region equipped with the solder pad and the manufacturing method thereof have advantages of being concise in flow, low in cost and environment-friendly and pollution-free without skip plating in gold immersion.
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Description

technical field

[0001] The invention relates to the technical field of manufacturing a rigid-flexible printed circuit board, in particular to a rigid-flexible board with solder pads in a flexible region. Background technique

[0002] Along with the demand for miniaturization and three-dimensional assembly of electronic products, rigid-flex boards have developed rapidly in recent years; at the same time, in order to cope with the more stringent miniaturization development trend, some products have tried to design pads in the flexible bending area. To reduce the pressure of rigid board mounting. For this type of rigid-flex board with pads in the flexible board area, the traditional method of immersion gold in the flexible part is to complete the pre-process treatment first, that is, the inner layer of the flexible board is made by cutting, drilling, and internal wiring. The cover film needs to be quickly pressed after the production of the flexible board circuit, and the loca...

Examples

Embodiment 1

[0030] like figure 1 As shown, a rigid-flex board with a pad in the flexible area includes a flexible board 1, a cover film, a PP prepreg 2, and a rigid board 3. The middle of the flexible board 1 is provided with a pad, with a solder pad. The outer surface of the flexible plate 1 of the disk is covered with a cover film, and the cover film is provided with a window suitable for the pad, and the window is compensated by increasing 0.1mm on one side. The flexible board 1 combined with the covering film, the PP prepreg 2 and the rigid board 3 are sequentially arranged and pressed from top to bottom to form a rigid-flex board.

[0031] like figure 1 and figure 2 As shown, a method for manufacturing a rigid-flex board with a pad in a flexible region includes the following steps:

[0032] The first step is the production of various raw materials in the previous process. The flexible board 1 with copper pads is manufactured until the cover film is pressed quickly, and the cover ...

Embodiment 2

[0044] like figure 1 As shown, a rigid-flex board with a pad in the flexible area includes a flexible board 1, a cover film, a PP prepreg 2, and a rigid board 3. The middle of the flexible board 1 is provided with a pad, with a solder pad. The outer surface of the flexible plate 1 of the disk is covered with a cover film, and the cover film is provided with a window suitable for the pad, and the window is compensated by increasing 0.2mm on one side. The flexible board 1 combined with the covering film, the PP prepreg 2 and the rigid board 3 are sequentially arranged and pressed from top to bottom to form a rigid-flex board.

[0045] like figure 1 and figure 2 As shown, a method for manufacturing a rigid-flex board with a pad in a flexible region includes the following steps:

[0046] The first step is the production of various raw materials in the previous process. The flexible board 1 with copper pads is manufactured until the cover film is pressed quickly, and the cover ...