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A cooling device and method for electronic components based on the Knudsen effect

A technology for electronic components and cooling devices, applied in electrical components, structural components of electrical equipment, cooling/ventilation/heating renovation, etc. problems, to achieve the effect of improving the cooling effect, improving the cooling efficiency, and the application potential is huge

Active Publication Date: 2018-04-20
GUANGXI UNIV
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a cooling device and method for electronic components based on the Knudsen effect, so as to overcome the problem that the cooling efficiency of the current mainstream electronic component cooling technology is not high, and the heat generated by the components cannot be discharged in time, resulting in limited performance. shortcoming

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  • A cooling device and method for electronic components based on the Knudsen effect
  • A cooling device and method for electronic components based on the Knudsen effect
  • A cooling device and method for electronic components based on the Knudsen effect

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Embodiment Construction

[0022] The specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, but it should be understood that the protection scope of the present invention is not limited by the specific embodiments.

[0023] Unless expressly stated otherwise, throughout the specification and claims, the term "comprise" or variations thereof such as "includes" or "includes" and the like will be understood to include the stated elements or constituents, and not Other elements or other components are not excluded.

[0024] figure 1 A schematic structural view of an electronic component cooling device according to a preferred embodiment of the present invention is shown. Such as Figure 1 to Figure 5 As shown, the cooling device for electronic components includes: a plurality of heat sinks, a plurality of metal parts, a plurality of Knudsen compressors 1, a condenser 2, a liquid reservoir 3, a capillary flow tube 4, a plurality of eva...

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Abstract

The invention discloses a Knudsen effect-based electronic component cooling device and method. The device comprises a plurality of heat sinks, a plurality of metal components respectively corresponding to the heat sinks one by one, a plurality of Knudsen compressors, a condenser, a capillary throttling pipe and a plurality of evaporators, wherein each Knudsen compressor comprises a cooling cavity, a hot cavity and a micro-channel, and each evaporator corresponds to a heating part of an electronic component. A Knudsen effect-based cooling system design is integrated on a cooling device for heating electronic components to replace the conventional heat dissipation and cooling device, and refrigeration can be realized by directly utilizing heat released by the electronic components to realize secondary cooling, so that the cooling efficiency and the cooling effect are improved, and the device and the method have a higher application value in the field of electronic component cooling.

Description

technical field [0001] The invention relates to the technical field of electronic component cooling, in particular to an electronic component cooling device and method based on the Knudsen effect. Background technique [0002] With the development of society, people's demand for high-performance electronic products is increasing, such as high-performance computers, data centers, etc. However, with the continuous improvement of the performance of electronic components, their power consumption is also increasing. Therefore, efficient and reliable heat dissipation is the key to ensure the performance of such components. At present, the mainstream heat dissipation technology has increasingly become a major bottleneck in the development of electronic component technology. Mainstream heat dissipation methods, such as natural convection heat dissipation, use the gaps between various electronic components in the equipment and the heat conduction, convection and heat radiation of th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/20309H05K7/20318H05K7/20354
Inventor 卢苇徐昆刘进阳许浩刘纪云陈汉王颖王博韬王南谢超许
Owner GUANGXI UNIV
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