Wafer metal coating structure adapted to thinned back and toolings thereof
A metal coating and wafer technology, applied to the photographic process of the pattern surface, the original for photomechanical processing, optics, etc., can solve the problems of pollution, easily damaged surface of the wafer, etc., and achieve the elimination of unbalanced force , eliminate the risk of cracking and bending, solve the effects of breakage and staining
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[0041] Such as figure 1 As shown, the metal is generally designed in the center of the wafer to meet the performance requirements of the device. Such as figure 2 As shown, the present invention specially designs and prepares a metal ring on the front side, which surrounds the edge of the wafer, eliminates the edge gap, improves the bonding effect between the front side of the wafer and the support carrier, and also solves the problem of abrasive particles entering the thinning grinding process. The problem.
[0042] Specific as Figure 4 As shown, a 5mm ring is designed from the edge of the wafer inward, and a layer of metal is prepared in this area at the same time when the wafer is operating the metal process. The same preparation process ensures that the thickness of the metal ring and the metal area are the same, so that there is no gap at the edge after the wafer is bonded to the support carrier, thereby ensuring that the wafer does not produce edge bending or cracks...
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